Semiconductor device manufacturing method

A semiconductor device manufacturing method comprising:

• forming a surface electrode and a protective film covering only a portion of the surface electrode on a front surface of a wafer, such that another portion of the surface electrode is exposed,
• thinning the wafer to form a wafer having an annular protruding portion on a peripheral portion thereof by grinding a central portion of a back surface of the wafer and then performing wet etching on the back surface of the wafer;
• forming a backside electrode directly on the back surface of the wafer;
• performing plating by immersing the wafer into a solution to evenly form a metal film on a portion of the backside electrode on the annular protruding portion and on the exposed another portion of the surface electrode;
• attaching a dicing tape to the metal film;
• and
• dicing the wafer having the dicing tape attached thereto, wherein
• the backside electrode is an Al alloy layer, and
• in the plating, the wafer is immersed in a zincate solution to deposit Zn on a surface of the Al alloy layer by displacement, the deposited Zn is removed, then the wafer is immersed in a zincate solution again to deposit Zn on the surface of the Al alloy layer by displacement, and subsequently the wafer is immersed in an electroless Ni plating solution, and after the wafer is immersed in the electroless Ni plating solution, the wafer is immersed in an electroless Au plating solution, and
• the metal film includes a portion formed over an inner wall surface of the annular protruding portion and provided closer to an edge of the wafer than the protective film.