Method and process using dual memorization layer for multi-color spacer patterning
AssigneeTokyo Electron Limited
InventorsHirokazu Aizawa, Kaoru Maekawa, Akiteru Ko
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AssigneeTokyo Electron Limited
InventorsHirokazu Aizawa, Kaoru Maekawa, Akiteru Ko
Estimating the term…
A self-aligned multiple patterning (SAMP) multi-color spacer patterning process is disclosed for formation of structures on substrates. Trenches and vias may be formed in the process. A trench memorization layer and a via memorization layer may be formed on the substrate. In one embodiment, the trench memorization layer and the via memorization layer are formed between the multi-color spacer patterning structures and a low-k interlayer dielectric layer. The use of the trench memorization layer and the via memorization layer allows the formation of trenches and vias in the low-k interlayer dielectric layer without causing damage to the low-k properties of the low-k interlayer dielectric layer.
A method of forming patterned layers on a substrate using a self-aligned multiple patterning (SAMP) process, comprising:
A method of forming trenches and vias on a substrate using a self-aligned multiple patterning (SAMP) process, comprising:
Dependencies are inferred from the claim text.