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US 11,380,575 B2Granted
Film thickness uniformity improvement using edge ring and bias electrode geometry
AssigneeApplied Materials, Inc.
InventorsKin Pong Lo, Vladimir Nagorny, Wei Liu, Theresa Kramer Guarini, Bernard L. Hwang, Malcolm J. Bevan, Jacob Abraham, Swayambhu Prasad Behera
Life of this patent
Estimating the term…
Abstract
Embodiments of the present disclosure generally relate to the fabrication of integrated circuits and to apparatus for use within a substrate processing chamber to improve film thickness uniformity. More specifically, the embodiments of the disclosure relate to an edge ring. The edge ring may include an overhang ring.
Claims20
An apparatus for substrate processing comprising:
- an edge ring, comprising:
- a bottom surface;
- an upper surface;
- and
- a groove disposed in the upper surface;
- an overhang ring disposed in the groove, the overhang ring further comprising:
- a first portion extending from the groove;
- and
- a second portion connected to the first portion and extending radially inward.
6 more elements
An apparatus for substrate processing comprising:
- an edge ring comprising:
- a bottom surface;
- an upper surface;
- a central opening;
- and
- a groove disposed in the upper surface;
- an overhang ring disposed in the groove, the overhang ring further comprising:
- a first portion extending upwards from the groove;
- and
- a second portion extending radially inward toward a central axis of the overhang ring.
7 more elements
An apparatus for substrate processing comprising:
- an edge ring, the edge ring further comprising:
- a support surface;
- an upper surface;
- a groove disposed in the upper surface;
- and
- a plurality of tabs disposed on the upper surface;
- an overhang ring disposed in the groove, the overhang ring further comprising:
- a first portion extending from the groove;
- and
- a second portion connected to the first portion and extending radially inward.
7 more elements
Dependencies are inferred from the claim text.