Structure for automatic in-situ replacement of a part of an electrostatic chuck

A substrate support for use in a reaction chamber, the substrate support comprising:

• a base;
• and
• an electrostatic chuck having
• a first electrode in an upper portion of the electrostatic chuck that is configured to hold a wafer to an upper surface of the upper portion by a first electrostatic attractive force under a condition of a first voltage is applied to the first electrode, and
• a second electrode that opposes an upper surface of the base and is configured to hold the electrostatic chuck to the base by a second electrostatic attractive force under a condition that a second voltage is applied to the second electrode, wherein
• under a condition that the second voltage is not supplied to the second electrode, the second electrostatic attractive force is not present and the electrostatic chuck is freed to be replaced in-situ without also removing the base and without exposing the reaction chamber to an external atmosphere.

An in-situ replaceable electrostatic chuck comprising:

• a body having an upper surface and a bottom surface;
• a thermally conductive resin sheet disposed on the bottom surface of the body, wherein
• the body including a dielectric plate having
• a first electrode disposed within an upper portion of the dielectric plate and having an upper surface that is oriented to support a wafer thereon,
• a second electrode disposed in a bottom portion of the dielectric plate or on a bottom surface of the body, the bottom surface being oriented to oppose an upper surface of a base,
• a first electrical conductor that provides a first voltage to the first electrode from a first voltage source, and
• a second electrical conductor that provides a second voltage to the second electrode from a second voltage source.