Substrate support carrier with improved bond layer protection

A substrate support pedestal comprising:

• an electrostatic chuck having a body comprising a cavity;
• a cooling base coupled to the electrostatic chuck via a bond layer;
• a gas flow passage formed between a top surface of the electrostatic chuck and a bottom surface of the cooling base, the gas flow passage including the cavity;
• a porous plug positioned within the cavity;
• and
• a sealing member positioned between the porous plug and a sidewall of the cavity, and configured to form a seal between the porous plug and the cavity.

A process chamber comprising:

• a chamber body having a processing volume:
• an electrostatic chuck disposed in the processing volume, the electrostatic chuck having a top surface configured to support a substrate during processing, a bottom surface, and a cavity;
• a cooling base coupled to the electrostatic chuck via a bond layer;
• a gas flow passage formed between the top surface of the electrostatic chuck and a bottom surface of the cooling base, the gas flow passage passing through the cavity;
• a porous plug positioned within the cavity;
• and
• a sealing member positioned between the porous plug and a sidewall of the cavity, and configured to form a seal between the porous plug and the cavity.