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US 11,380,526 B2Granted
Stage and plasma processing apparatus
AssigneeTokyo Electron Limited
InventorsDaisuke Hayashi, Tomoyuki Takahashi
Life of this patent
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Abstract
A stage on which a substrate is disposed includes: a base embedded with an adsorption electrode therein; a focus ring provided above the adsorption electrode and adsorbed and held on the base; and a deposit control ring provided radially inside the focus ring on the base. A gap is formed between the focus ring and the deposit control ring in a radial direction to separate the focus ring and the deposit control ring.
Claims17
A stage on which a substrate is disposed, comprising:
- a base embedded with an adsorption electrode therein;
- a focus ring provided above the adsorption electrode and adsorbed and held on the base;
- and
- a deposit control ring provided radially inside the focus ring on the base,
- wherein a gap is formed between the focus ring and the deposit control ring in a radial direction to separate the focus ring and the deposit control ring, and
- at least a contact surface of the deposit control ring or a contact surface of the base is surface-treated such that a contact thermal resistance between the deposit control ring and the base becomes larger than a contact thermal resistance between the focus ring and the base.
3 more elements
A plasma processing apparatus comprising:
- a processing container that defines a processing space in which plasma is generated;
- and
- a stage on which a substrate is disposed inside the processing container,
- wherein the stage includes:
- a base embedded with an adsorption electrode therein;
- a focus ring provided above the adsorption electrode and adsorbed and held on the base;
- and
- a deposit control ring provided radially inside the focus ring on the base, and
- wherein a gap is formed between the focus ring and the deposit control ring in a radial direction to separate the focus ring and the deposit control ring.
6 more elements
Dependencies are inferred from the claim text.