System and method for generating and analyzing roughness measurements and their use for process monitoring and control

An edge detection system, comprising:

• an imaging device configured to generate a first image of a pattern structure, wherein the first image of the pattern structure includes image noise;
• and
• a processor, coupled to the imaging device, the processor configured to:
• generate, based at least in part on the first image of the pattern structure, measured linescan information describing a pattern structure of a feature;
• apply the measured linescan information to an inverse linescan model that relates measured linescan information to feature geometry information;
• identify, based at least in part on the applying the measured linescan model to the inverse linescan model, feature geometry information that describes a feature that would produce a linescan corresponding to the received measured linescan information;
• determine, at least in part using the inverse linescan model, feature edge positions of the identified feature;
• analyze the feature edge positions to determine errors in the manufacture of the pattern structure;
• and
• control a lithography tool based on the analysis of the feature edge positions.

A tangible, non-transitory computer-readable medium storing instructions that, when executed, cause a processing device to:

• obtain a first image of a pattern structure, wherein the first image of the pattern structure includes image noise;
• generate, based at least in part on the first image of the pattern structure, measured linescan information describing a pattern structure of a feature;
• apply the measured linescan information to an inverse linescan model that relates measured linescan information to feature geometry information;
• identify, based at least in part on the applying the measured linescan model to the inverse linescan model, feature geometry information that describes a feature that would produce a linescan corresponding to the received measured linescan information;
• determine, at least in part using the inverse linescan model, feature edge positions of the identified feature;
• analyze the feature edge positions to determine errors in the manufacture of the pattern structure;
• and
• control a lithography tool based on the analysis of the feature edge positions.