Multilayer electronic component for enhanced moisture resistance and bending strength

A multilayer electronic component comprising:

• a body including dielectric layers, and first and second internal electrodes alternately stacked with respective dielectric layers interposed therebetween, the body having first and second surfaces opposing each other in a stacking direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other;
• a first external electrode including a first electrode layer connected to the first internal electrode, a first conductive resin layer disposed on the first electrode layer, and a first plating layer disposed on the first conductive resin layer, and each having a first connection portion disposed on the third surface of the body and a first band portion extending from the first connection portion to a portion of each of the first, second, fifth, and sixth surfaces;
• a second external electrode including a second electrode layer connected to the second internal electrode, a second conductive resin layer disposed on the second electrode layer, and a second plating layer disposed on the second conductive resin layer, and each having a second connection portion disposed on the fourth surface of the body and a second band portion extending from the second connection portion to a portion of each of the first, second, fifth, and sixth surfaces;
• and
• a silicon (Si) organic compound layer having a body cover portion disposed on a region of external surfaces of the body between the first and second conductive resin layers, a first extending portion disposed to extend from the body cover portion to a region between the first conductive resin layer and the first plating layer, and a second extending portion disposed to extend from the body cover portion to a region between the second conductive resin layer and the second plating layer,
• wherein the first and second extending portions have first and second openings, respectively, and
• wherein Tb/Ta is 0.5 or more and 0.9 or less, where a thickness of the first conductive resin layer on the first band portion of the first electrode layer is defined as ‘Ta’ and a thickness of the first extending portion is defined as ‘Tb’.

A multilayer electronic component comprising:

• a body including dielectric layers, and first and second internal electrodes alternately stacked with a respective dielectric layer interposed therebetween in a stacking direction, the first and second internal electrodes being exposed to opposing end surfaces of the body in a length direction perpendicular to the stacking direction;
• first and second external electrodes comprising:
• first and second electrode layers disposed on the end surfaces of the body and connected to the first and second internal electrodes, respectively, the first and second electrode layers further extending inwardly in the length direction along surfaces of the body that connect the end surfaces to each other;
• first and second conductive resin layers to cover the first and second electrode layers, respectively;
• and
• first and second plating layers to cover the first and second conductive resin layers, respectively;
• and
• a silicon (Si) organic compound layer disposed to cover exterior surfaces of the body, the first and second electrode layers, and the first and second conductive resin layers,
• wherein the Si organic compound layer has one or more first openings between the first conductive resin layer and the first plating layer such that the first conductive resin layer and the first plating layer are in contact through the one or more first openings, and has one or more second openings between the second conductive resin layer and the second plating layer such that the second conductive resin layer and the second plating layer are in contact through the one or more second openings, and
• wherein Tb/Ta is 0.5 or more and 0.9 or less, where a thickness of the first conductive resin layer on a first band portion of the first electrode layer in the stacking direction is defined as ‘Ta’ and a thickness of the Si organic compound layer above or below the first band portion of the first electrode layer in the stacking direction is defined as ‘Tb’.