Detecting defects in semiconductor specimens using weak labeling
AssigneeApplied Materials Israel Ltd.
InventorsIrad Peleg, Ran Schleyen, Boaz Cohen
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AssigneeApplied Materials Israel Ltd.
InventorsIrad Peleg, Ran Schleyen, Boaz Cohen
Estimating the term…
A system of classifying a pattern of interest (POI) on a semiconductor specimen, where the system includes a processor and memory circuitry configured to obtain a high-resolution image of the POI, and generate data usable for classifying the POI in accordance with a defectiveness-related classification. Generating the data utilizes a machine learning model that has been trained in accordance with training samples. The training samples include a high-resolution training image captured by scanning a respective training pattern on a specimen, the respective training pattern being similar to the POI, and a label associated with the image. The label is derivative of low-resolution inspection of the respective training pattern.
A system for classifying a pattern of interest (POI) on a semiconductor specimen, the system comprising a processor and memory circuitry (PMC) configured to:
A method of classifying a pattern of interest (POI) on a semiconductor specimen from a high-resolution image of the pattern, the method comprising:
A computer program product stored on a non-transitory computer-readable medium containing program instructions, which program instructions when read by a processor, cause the processor to perform a method of training a machine learning model to, given input data informative of a high-resolution image of a pattern of interest (POI), generate data usable for classifying the POI in accordance with a defectiveness-related classification, the method comprising:
Dependencies are inferred from the claim text.