Method for III-V/silicon hybrid integration
AssigneeRockley Photonics Limited
InventorsGuomin Yu, Mohamad Dernaika, Ludovic Caro, Hua Yang, Aaron John Zilkie
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Abstract
A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.
Claims25
An optoelectronic device comprising:
- a precursor photonic device, comprising:
- a substrate,
- a bonding region, for receiving and bonding to a transfer die,
- one or more alignment marks;
- and
- one or more metal patches covering the respective alignment marks,
- wherein a first alignment mark of the one or more alignment marks is at least partially defined by a first trench, and a first metal patch of the one or more metal patches respective to the first alignment mark covers a region adjacent to the first alignment mark.
An optoelectronic device comprising:
- a precursor photonic device, comprising:
- a substrate,
- a bonding region, for receiving and bonding to a transfer die,
- one or more alignment marks, and
- one or more metal patches covering the respective alignment marks;
- and
- a transfer die comprising a photonic device, said photonic device having a bonding surface bonded to the bonding region of the precursor photonic device,
- wherein the photonic device is an electro-absorption modulator, wherein said electro-absorption modulator comprises an input waveguide and an output waveguide, and wherein both of said input waveguide and said output waveguide comprise a port located on a same side of the transfer die.
An optoelectronic device comprising:
- a precursor photonic device, comprising:
- a substrate,
- a bonding region, for receiving and bonding to a transfer die,
- one or more alignment marks, and
- one or more metal patches covering the respective alignment marks;
- and
- a transfer die comprising a photonic device, said photonic device having a bonding surface bonded to the bonding region of the precursor photonic device,
- wherein the precursor photonic device includes a first waveguide and the transfer die includes a second waveguide, and, once bonded, an interface between the first waveguide and the second waveguide is angled relative to a guiding direction of the first waveguide or second waveguide.
An optoelectronic device comprising:
- a precursor photonic device, comprising:
- a substrate,
- a bonding region, for receiving and bonding to a transfer die,
- one or more alignment marks, and
- one or more metal patches covering the respective alignment marks;
- and
- a transfer die comprising a photonic device, said photonic device having a bonding surface bonded to the bonding region of the precursor photonic device,
- wherein:
- the precursor photonic device includes a first waveguide;
- the transfer die includes a second waveguide;
- and
- the first waveguide, the second waveguide, or both, include a T-bar facet.
Dependencies are inferred from the claim text.