Techniques for compact optical sensing module with hybrid multi-chip integration

A light detection and ranging (LIDAR) system, comprising:

• a photonics chip coupled to a substrate, the photonics chip comprising:
• an optical source to generate an optical beam,
• a waveguide to direct the optical beam through the photonics chip,
• a photodetector to generate an electrical signal in response to detecting a return signal, and
• an optical coupler to transmit the optical beam from the waveguide to a target in a field of view of the LIDAR system;
• and
• one or more integrated circuit (IC) chips coupled to the photonics chip, through one or more electrical contacts between the one or more IC chips and the photonics chip to process the electrical signal generated by the photodetector, wherein the one or more IC chip is physically separated from the substrate to reduce crosstalk on the LIDAR apparatus.

A method comprising:

• attaching an integrated circuit (IC) chip to a surface of a photonics chip, the photonics chip comprising a plurality of integrated optic components, wherein the IC chip is soldered to the photonics chip through one or more electrical contacts;
• attaching the photonics chip to a printed circuit board (PCB) to electrically couple the photonics chip with the PCB;
• and
• attaching a processing device to the PCB to be electrically coupled with the photonics chip via electrical circuits of the PCB, and wherein the IC chip is physically separated from the PCB to reduce crosstalk.