Thermal test head for an integrated circuit device
AssigneeAEM Singapore Pte. Ltd.
InventorsSee Jean Chan, Zhaomeng Wang, Yao Kun Leonard Mak, MuralliKrishna Govindandhanasekaran
Life of this patent
Estimating the term…
Abstract
A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.
Claims18
A thermal test head for an integrated circuit device including a die mounted on a substrate, the thermal test head comprising:
- a heat exchanger assembly configured to circulate a fluid therethrough, the heat exchanger assembly including
- a manifold defining a cavity,
- a cold plate including micro-fins on a first surface of the cold plate, and
- a channel body defining fluid-flow channels, wherein the micro-fins and the channel body are disposed in the cavity of the manifold;
- a die-contact member configured to contact the die;
- and
- a thermal control assembly disposed between the heat exchanger assembly and the die-contact member, the thermal control assembly including
- a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the die-contact member, and
- a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the die-contact member.
A thermal test head for an integrated circuit device including a die mounted on a substrate, the thermal test head comprising:
- a heat exchanger assembly configured to circulate a fluid therethrough;
- a die-contact member including a contact surface, the contact surface being configured to contact the die;
- and
- a thermal control assembly disposed between the heat exchanger assembly and the die-contact member, the thermal control assembly including
- a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the die-contact member, and
- one or more spacers disposed at least partially around the Peltier device, the one or more spacers being in physical contact with the opposing surfaces of the heat exchanger assembly and the die-contact member;
- and
- an inclination-adjustment device coupled to the heat exchanger assembly opposite the thermal control assembly, wherein the inclination-adjustment device is configured to change an angular alignment of the contact surface of the die-contact member when the contact surface contacts the die.
A thermal test head for an integrated circuit device including a die mounted on a substrate, the thermal test head comprising:
- a heat exchanger assembly configured to circulate a fluid therethrough;
- a thermally conductive die-contact member including a contact surface, the contact surface being configured to contact the die;
- and
- a thermal control assembly disposed between a first surface of the die-contact member and a second surface of the heat exchanger assembly, wherein the thermal control assembly includes:
- a Peltier device,
- a first layer of thermal interface material disposed between, and in physical contact with, the Peltier device and the first surface of the die-contact member,
- a second layer of thermal interface material disposed between, and in physical contact with, the Peltier device and the second surface of the heat exchanger assembly, and
- one or more spacers disposed at least partially around the Peltier device and in physical contact with the first surface of the die-contact member and the second surface of the heat exchanger assembly, wherein a height of the one or more spacers is substantially equal to a sum of a height of the Peltier device, a height of the first layer of thermal interface material, and a height of the second layer of thermal interface material.
Dependencies are inferred from the claim text.