Device and method for monitoring the health of a power semiconductor die
AssigneeMitsubishi Electric Corporation
InventorsNicolas Degrenne, Stefan Mollov, Jeffrey Ewanchuk
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Abstract
A device having at least one power semiconductor die coated with a metallization and at least one light guide having two opposite ends. The first end is able to be connected at least to a light source and to a light receiver. The second end is permanently fixed facing to a surface of the metallization such that to form a light path towards said surface and a light path from said surface.
Claims17
A device for monitoring a power semiconductor die coated with a metallization, comprising:
- at least one power semiconductor die coated with a metallization;
- at least one light guide having two opposite ends, a first end being able to be connected at least to a light source and to a light receiver, the second end being permanently fixed facing to a surface of the metallization such that to form a light path towards said surface and a light path from said surface;
- and
- an assembling material for use with the second end of the at least one light guide and the surface of the metallization to preserve a transparency of the device, wherein
- the second end of the at least one light guide is located approximately at the middle of the at least one power semiconductor die and directly adjacent to the metallization, such that the second end of the at least one light guide is not disposed within the metallization.
A device for monitoring power semiconductor dies coated with a metallization, comprising at least two power semiconductor dies coated with a metallization and each associated to a respective light guide, each having a first end and a second opposite end, the two first ends being connected to a common light source through a light splitter and being connected to a common light receiver through a light coupler, the two second ends being permanently fixed facing to the surface of the respective metallization such that to form a respective light path until said surface and/or a respective light path from said surface.
A device for monitoring power semiconductor dies coated with a metallization, comprising N power semiconductor dies coated with a metallization, N being greater or equal to two;
- and a common light guide;
- said light guide including N distinct second ends being permanently fixed facing to a respective surface of each metallization such that to form a light path until a first of the N surfaces and to form a light path from the last of the N surfaces, said light guide further including N−1 intermediate light paths between the second ends each arranged to collect a light beam reflected from one of the N surfaces and to guide said light beam until another surface of the N surfaces.
Dependencies are inferred from the claim text.