Device and method for processing a multiplicity of semiconductor chips
AssigneeOSRAM Opto Semiconductors GmbH
InventorsMichael Bergler, Roland Zeisel
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Abstract
A device for processing a multiplicity of semiconductor chips in a wafer assemblage includes an electrically conductive carrier for contacting rear contacts of the semiconductor chips, an electrically conductive film for contacting front contacts of the semiconductor chips that are situated opposite the rear contacts, and a squeegee, which is displaceable relative to the film and is configured to press a region of the film in the direction toward the carrier.
Claims15
A device for processing a plurality of semiconductor chips in a wafer assemblage, the device comprising:
- an electrically conductive carrier for contacting rear contacts of the semiconductor chips,
- an electrically conductive film for contacting front contacts of the semiconductor chips, which are opposite to the rear contacts, and
- a doctor blade displaceable relative to the film and designed to press a portion of the film toward the carrier.
A method of processing a plurality of semiconductor chips in a wafer assemblage, the method comprising:
- electrically contacting rear contacts of the semiconductor chips,
- pressing a region of an electrically conductive film against a portion of front contacts of the semiconductor chips opposite to the rear contacts, thereby electrically contacting the portion of the front, contacts, and
- moving the portion of the film.
Dependencies are inferred from the claim text.