Substrate inspection method, substrate inspection apparatus and recording medium

A substrate inspection apparatus, comprising:

• a holding table configured to hold and rotate a target substrate;
• and
• a controller configured to control a camera,
• wherein the controller performs:
• (1-1) taking, while rotating the holding table on which a reference substrate whose warpage amount is already known is held, an image of an end surface of the reference substrate over an entire circumference of a periphery of the reference substrate by the camera;
• (1-2) obtaining shape data on the end surface of the reference substrate over the entire circumference of the periphery of the reference substrate by processing the image obtained in the taking of the image of the end surface of the reference substrate;
• (1-3) obtaining information on a rotational position of the holding table with respect to the shape data of the reference substrate;
• (2-1) taking, while rotating the holding table on which the target substrate is held, an image of an end surface of the target substrate over an entire circumference of a periphery of the target substrate by the camera;
• (2-2) obtaining shape data on the end surface of the target substrate over the entire circumference of the periphery of the target substrate by processing the image obtained in the taking of the image of the end surface of the target substrate;
• (2-3) obtaining information on a rotational position of the holding table with respect to the shape data of the target substrate;
• (2-4) correcting the shape data of the target substrate such that the rotational position of the holding table with respect to the shape data of the reference substrate coincides with the rotational position of the holding table with respect to the shape data of the target substrate;
• and
• (2-5) calculating a warpage amount of the target substrate by obtaining a difference between the shape data obtained in (1-2) and the shape data corrected in (2-4).