Heat treatment device
AssigneeIHI Corporation
InventorsAkihisa Yano, Tatsuya Oka, Takahito Akita, Taiga Yamamoto, Hideshi Shibuya, Yusuke Takeuchi, Hiroyuki Kamata
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AssigneeIHI Corporation
InventorsAkihisa Yano, Tatsuya Oka, Takahito Akita, Taiga Yamamoto, Hideshi Shibuya, Yusuke Takeuchi, Hiroyuki Kamata
Estimating the term…
A heat treatment device includes first heat transfer bodies including first flow channels, second heat transfer bodies including second flow channels and each being stacked on the respective first heat transfer bodies, and a casing having a space communicating with the second flow channels and being in contact with each surface including the edge of the connection interface between each first heat transfer body and each second heat transfer body. The first heat transfer bodies each include a third flow channel provided in a wall portion isolating the first flow channels from the space of the casing. The first flow channels are grooves in contact with the connection interface, and the third flow channel is a groove in contact with the connection interface and intersecting with a virtual line connecting the first flow channels with the space of the casing at the connection interface.
A heat treatment device utilizing heat exchange between a first fluid and a second fluid, the device comprising:
Dependencies are inferred from the claim text.