Sublimation defrosting method, sublimation defrosting device, and cooling device
AssigneeMayekawa Mfg. Co., Ltd.
InventorsMasashi Kato, Kosaku Nishida
Life of this patent
Estimating the term…
Abstract
There is provided a sublimation defrosting method for removing a frost layer adhering to a cooling surface for cooling a to-be-cooled gas, including a heating/temperature-rising step of heating an adhesion portion of the cooling surface, to which the frost layer adheres, to rise a temperature of the adhesion portion by a heat source located on an adhesion portion side with respect to the frost layer, under a temperature condition below a melting point of the frost layer.
Claims19
A sublimation defrosting device for removing a frost layer adhering to a cooling surface for cooling a to-be-cooled gas;
- the device comprising:
- a heating/temperature-rising part configured to heat an adhesion portion of the cooling surface, to which the frost layer adheres, to rise a temperature of the adhesion portion, with a heat source located on an adhesion portion side with respect to the frost layer;
- a temperature sensor for detecting the temperature of the adhesion portion;
- and
- a control part into which a detection value of the temperature sensor is input and which operates the heating/temperature-rising part so as to rise the temperature of the adhesion portion under a temperature condition below a melting point of the frost layer and form a temperature gradient from a root-side region to a tip-side region of the frost layer,
- wherein the control part is configured to control the heating/temperature-rising part such that the frost layer has a temperature distribution in which a tip of the frost layer has a temperature lower than the adhesion portion and the frost layer has a region whose temperature is lower than the tip of the frost layer, during transient change due to heating and temperature-rising caused by the heating/temperature-rising part.
A sublimation defrosting device for removing a frost layer adhering to a cooling surface for cooling a to-be-cooled gas;
- the device comprising:
- a heating/temperature-rising part configured to heat an adhesion portion of the cooling surface, to which the frost layer adheres, to rise a temperature of the adhesion portion, with a heat source located on an adhesion portion side with respect to the frost layer;
- and
- a cooling part disposed to face the adhesion portion and configured to cool the tip-side region of the frost layer,
- wherein the sublimation defrosting device is configured such that the heating/temperature-rising part rises the temperature of the adhesion portion under a temperature condition below a melting point of the frost layer while the cooling part cools the tip-side region of the frost layer to form a temperature gradient from a root-side region to a tip-side region of the frost layer.
A sublimation defrosting method for removing a frost layer adhering to a cooling surface for cooling a to-be-cooled gas;
- the method comprising
- a heating/temperature-rising step of heating an adhesion portion of the cooling surface, to which the frost layer adheres, to rise a temperature of the adhesion portion by a heat source located on an adhesion portion side with respect to the frost layer, under a temperature condition below a melting point of the frost layer,
- wherein the heating/temperature-rising step is performed by a heating/temperature- rising part,
- the temperature of the adhesion portion is detected by a temperature sensor,
- a detection value of the temperature sensor is input into a control part, the control part operates the heating/temperature-rising part so as to rise the temperature of the adhesion portion under the temperature condition below the melting point of the frost layer and form a temperature gradient from a root-side region to a tip-side region of the frost layer, the control part controls the heating/temperature-rising part such that the frost layer has a temperature distribution in which a top of the frost layer has a temperature lower than the adhesion portion and the frost layer has a region whose temperature is lower than the tip of the frost layer, during transient change due to heating and temperature-rising caused by the heating/temperature-rising part.
Dependencies are inferred from the claim text.