Hot melt composition
AssigneeHenkel AG & Co. KGaA
InventorsShingo Tsuno, Masaaki Dobashi, Takahide Morishita, Koji Shirai
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Abstract
An objective of the present invention is to provide a hot melt composition which has a high form maintaining property at a high temperature, is well-balanced between adhesion and removability to a substrate, hardly sags, has less volatile matter content and is excellent in hygiene. The present invention relates to a hot melt composition comprising: (A) a thermoplastic block copolymer which is a copolymer of a vinyl-based aromatic hydrocarbon and a conjugated diene compound, (B1) a hydrocarbon-based oil having an aniline point of 135° C. or more, and (C) a wax modified with a carboxylic acid and/or a carboxylic acid anhydride.
Claims5
An electronic control unit sealed with hot melt composition consisting of:
- (A) a mixture of styrene-ethylene/propylene block copolymer and styrene-ethylene-ethylene/propylene-styrene block copolymer;
- (B) a hydrocarbon-based oil having an aniline point of 135° C. or more;
- (C) a wax modified with a carboxylic acid and/or a carboxylic acid anhydride;
- (D) a mixture of a tackifier selected from the group consisting of hydrogenated C5 resin, hydrogenated DCPD resin, and pure C9 monomer resin;
- and
- (E) at least one optional component selected from the group consisting of antioxidant, polyolefin wax, Fischer-Tropsch wax, silane coupling agent, bis A epoxy resin, and glass balloons.
Dependencies are inferred from the claim text.