Adhesive composition
AssigneeLG Chem, Ltd.
InventorsSo Young Kim, Seung Min Lee, Se Woo Yang
Life of this patent
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Abstract
Disclosed is related to an adhesive composition for encapsulating an organic electronic element and an organic electronic device comprising the same. The adhesive composition includes a curable compound having no carbon-carbon unsaturated group, a thermal initiator, and a photo-initiator. The adhesive composition can form a structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device, can realize a top emitting organic electronic device, and can prevent defects such as dark spots which may occur in the organic electronic device.
Claims15
An adhesive composition for encapsulating an organic electronic element comprising:
- a first curable compound and either a second curable compound or a third curable compound, each curable compound having no carbon-carbon unsaturated group,
- a thermal initiator, and
- a photo-initiator,
- wherein the adhesive composition is in a liquid form at room temperature,
- wherein the adhesive composition has a Shore hardness (Shore A) of 20 to 60 as measured according to the standard of JIS K 6253 after pre-curing,
- wherein the thermal initiator is comprised in an amount of 0.01 to 0.45 parts by weight relative to 100 parts by weight of the curable compounds,
- wherein the photo-initiator is comprised in an amount of 0.01 to 0.45 parts by weight relative to 100 parts by weight of the curable compounds,
- wherein the first curable compound comprises a compound having a cyclic structure in its molecular structure, and
- wherein the second curable compound comprises a linear or branched aliphatic compound, and when present is provided in an amount of 5 to 60 parts by weight relative to 100 parts by weight of the first curable compound;
- and
- wherein the third curable compound comprises a compound containing at least one or more oxetane groups, and when present is provided in an amount of 5 to 60 parts by weight relative to 100 parts by weight of the first curable compound.
Dependencies are inferred from the claim text.