Method of manufacturing electronic device

A method of manufacturing an electronic device having at least one electronic component covered with a molded part, the method comprising:

• housing a first electronic component in a metal mold, then
• filling the metal mold with a molding material to form the molded part, wherein
• the metal mold includes
• a housing cavity having a rectangular planar shape and housing the first electronic component, the housing cavity having four side surfaces,
• a first dummy cavity having a side surface facing a first side surface of the four side surfaces of the housing cavity;
• a second dummy cavity having a side surface facing a second side surface of the four side surfaces of the housing cavity;
• a first communication channel between the side surface of the first dummy cavity and the first side surface of the housing cavity;
• and
• a second communication channel between the side surface of the second dummy cavity and the second side surface of the housing cavity,
• wherein in the filling of the metal mold with the molding material, the molding material inflows into the housing cavity first, and the molding material in the housing cavity thereafter inflows into the first dummy cavity via the first communication channel, and inflows into the second dummy cavity via the second communication channel.