Method of handling a substrate
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYou-Hua Chou, Kuo-Sheng Chuang
Life of this patent
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Abstract
A method of aligning a substrate contact material to a substrate material includes determining a hardness of a substrate material. The method further includes matching a hardness of a substrate contact material to the hardness of the substrate material. The method further includes adding the substrate contact material to a plurality of contact structures of a substrate handling device, wherein the substrate handling device comprises an edge and a planar surface, a first contact structure of the plurality of contact structures extends from the edge, and a second contact structure of the plurality of contact structures extends from the planar surface.
Claims20
A method of aligning a substrate contact material to a substrate material, the method comprising:
- determining a hardness of a substrate material;
- matching a hardness of a substrate contact material to the hardness of the substrate material;
- and
- adding the substrate contact material to a plurality of contact structures of a substrate handling device, wherein the substrate handling device comprises an edge and a planar surface, the edge being angled with respect to the planar surface, a first contact structure of the plurality of contact structures directly contacts the edge and extends from the edge, and a second contact structure of the plurality of contact structures extends from the planar surface.
A method of aligning a substrate contact material to a substrate material, the method comprising:
- determining a hardness of a substrate material;
- matching a hardness of a substrate contact material to the hardness of the substrate material;
- adding the substrate contact material to a first contact structure of a substrate handling device, wherein the first contact structure extends from a planar surface of the substrate handling device;
- and
- adding the substrate contact material to a second contact structure of the substrate handling device, wherein the second contact structure extends from an edge of the substrate handling device, the second contact structure directly contacts the edge, and the edge is angled with respect to the planar surface.
A method of aligning a substrate contact material to a substrate material, the method comprising:
- determining a hardness of a substrate material;
- matching a hardness of a substrate contact material to the hardness of the substrate material;
- adding the substrate contact material to a first contact structure of a substrate handling device, wherein the substrate handling device comprises a planar surface and an edge, wherein the edge is angled with respect to the planar surface, and the first contact structure directly contacts the edge and extends from the edge;
- and
- modifying a surface of the substrate contact material to increase a coefficient of static friction.
Dependencies are inferred from the claim text.