US 11,376,694 B2 · Flux and solder paste

Abstract

Provided is flux that can achieve a low residue so as to make it possible to ensure solder wettability, ensure holding properties of a solder ball, and suppress the amount of residue after soldering and enable application for use without washing. The flux includes 1-15% by weight of an organic acid mixture comprising an organic acid with 10 or more carbon atoms, 50-90% by weight of isobornyl cyclohexanol, and 5-45% by weight of a different solvent. The proportion of the isobornyl cyclohexanol is 50-95% by weight, where 100% by weight is the total of the isobornyl cyclohexanol and the different solvent. The organic acid mixture comprising the organic acid with 10 or more carbon atoms comprises 2-methylnonanedioic acid, 4-(methoxycarbonyl)-2,4-dimethylundecanedioic acid, 4,6-bis(methoxycarbonyl)-2,4,6-trimethyldecanedioic acid, and 8,9-bis(methoxycarbonyl)-8,9-dimethylhexadecanedioic acid.

Claims8

Dependent claims

A flux comprising:

1 wt % or more and 15 wt % or less of an organic acid mixture including an organic acid with 10 or more carbon atoms;
50 wt % or more and 90 wt % or less of isobornyl cyclohexanol;
and
5 wt % or more and 45 wt % or less of a different solvent,
the flux being free of a thermosetting resin,
wherein, when a total amount of the isobornyl cyclohexanol and the different solvent is 100 wt %, a ratio of the isobornyl cyclohexanol is 50 wt % or more and 95 wt % or less, and
wherein the organic acid mixture including an organic acid with 10 or more carbon atoms includes 2-methylnonanedioic acid, 4-(methoxycarbonyl)-2,4-dimethylundecanedioic acid, 4,6-bis(methoxycarbonyl)-2,4,6-trimethyltridecanedioic acid, and 8,9-bis(methoxycarbonyl)-8,9-dimethylhexadecanedioic acid.

4 more elements

Dependencies are inferred from the claim text.

Flux and solder paste

Life of this patent

Flux and solder paste

Life of this patent

Abstract

Claims8