Conductive coating material and production method for shielded package using conductive coating material

A conductive coating material comprising at least:

• (A) 100 parts by mass of a binder component including 5 to 30 parts by mass of a solid epoxy resin that is a solid at normal temperature and 20 to 90 parts by mass of a liquid epoxy resin that is a liquid at normal temperature, provided that the total amount of the solid and liquid epoxy resins does not exceed 100 parts by mass;
• (B) 200 to 1800 parts by mass of silver-coated copper alloy particles which are copper alloy particles covered with a silver-containing layer, in which the copper alloy particles are made of an alloy of copper, nickel, and zinc, the silver-coated copper alloy particles have a nickel content of 0.5% to 20% by mass, and the silver-coated copper alloy particles have a zinc content of 1% to 20% by mass with respect to 100 parts by mass of the binder component (A);
• and
• (C) 0.3 to 40 parts by mass of a curing agent with respect to 100 parts by mass of the binder component (A).