Curable compositions and related methods
Assignee3M Innovative Properties Company
InventorsLianzhou Chen, Dmitriy Salnikov
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Abstract
Provided is a curable composition containing a reactive mixture of components including an polyethersulfone having a chemical group reactive with an epoxide, a cycloaliphatic polyepoxide resin, a polyepoxide having a functionality greater than two, a liquid diepoxide resin, a first curative containing 9,9-bis(aminophenyl)fluorene or a derivative therefrom and having a curing onset temperature of from 150° C. to 200° C. The components can further comprise a second curative having a curing onset temperature of from 60° C. to 180° C. When thermally curing this composition, the second epoxy curative starts to cure before the first epoxy curative, thereby inhibiting vertical flow of the adhesive during the curing process.
Claims10
A curable composition comprising a reactive mixture of components comprising:
- a polyethersulfone having a chemical group reactive with an epoxide;
- a cycloaliphatic polyepoxide resin;
- a polyepoxide having a functionality greater than two;
- a liquid diepoxide resin;
- a first curative comprising 9,9-bis(aminophenyl)fluorene or derivative therefrom, the first curative being present in an amount of from 2% to 50% by weight, based on the overall weight of the curable composition;
- a second curative comprising dicyandiamide and present in an amount of from 0.01% to 5% by weight, based on the overall weight of the curable composition;
- and
- an accelerator comprising an imidazole and present in an amount of from 0.01% to 2% by weight, based on the overall weight of the curable composition.
An adhesive film comprising:
- a first curative comprising 9,9-bis(aminophenyl)fluorene or derivative therefrom, the first curative being present in an amount of from 2% to 50% by weight, based on the overall weight of the curable composition;
- a second curative comprising dicyandiamide and present in an amount of from 0.01% to 5% by weight, based on the overall weight of the curable composition;
- and
- an accelerator comprising an imidazole and present in an amount of from 0.01% to 2% by weight, based on the overall weight of the curable composition,
- wherein the adhesive film resists sagging when adhered to a vertical substrate and heated to a temperature of from 50° C. to 250° C.
Dependencies are inferred from the claim text.