Ultrasonic bonding apparatus, control device and control method
AssigneeKabushiki Kaisha Toshiba
InventorsTakahiro Aizawa, Takashi Ito, Masatoshi Tanabe, Haruka Yamamoto
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Abstract
An ultrasonic bonding apparatus includes a sensor that detects vibration along a height direction in a bonding target member which vibrates by ultrasonic vibration. The ultrasonic bonding apparatus includes a control device that changes control parameters associated with the driving of a bonding tool based on information related to the vibration along the height direction detected by the sensor.
Claims5
An ultrasonic bonding apparatus comprising:
- a stage where a bonding target member can be arranged on an upper side in a height direction, the height direction being perpendicular or approximately perpendicular to a bonded surface of the bonding target member;
- a bonding tool arranged above the bonding target member in the height direction, and configured to bond the bonding target member by being driven in a state of using pressurizing force to press the bonding target member downward in the height direction and transmitting ultrasonic vibration, which vibrates in a direction along the bonded surface, to the bonding target member;
- a sensor configured to detect vibration along the height direction in the bonding target member when the ultrasonic vibration vibrating in the direction along the bonded surface is transmitted to the bonding target member;
- and
- a control device configured to change a control parameter associated with driving of the bonding tool based on information related to the vibration along the height direction detected by the sensor.
A control device used together with a bonding tool configured to bond a bonding target member by being driven in a state of using pressurizing force to press the bonding target member downward in a height direction and transmitting ultrasonic vibration, which vibrates in a direction along a bonded surface of the bonding target member, to the bonding target member, the height direction being perpendicular or approximately perpendicular to the bonded surface, the control device comprising
- a processor configured to change a control parameter associated with the driving of the bonding tool based on information related to vibration along the height direction in the bonding target member, the vibration along the height direction being detected when the ultrasonic vibration vibrating in the direction along the bonded surface is transmitted to the bonding target member.
A control method comprising:
- bonding a bonding target member by driving a bonding tool in a state of using pressurizing force to press the bonding target member downward in a height direction and transmitting ultrasonic vibration, which vibrates in a direction along a bonded surface of the bonding target member, to the bonding target member, the height direction being perpendicular or approximately perpendicular to the bonded surface;
- detecting vibration along the height direction in the bonding target member when the ultrasonic vibration vibrating in the direction along the bonded surface is transmitted to the bonding target member;
- and
- changing a control parameter associated with the driving of the bonding tool based on information related to the detected vibration along the height direction of the bonding target member.
Dependencies are inferred from the claim text.