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US 11,365,291 B2Granted
Continuous process for polymer/fiber molding compounds using polymer dispersions
AssigneeDow Global Technologies LLC
InventorsAmit K. Chaudhary, Eric L. Marchbanks
Life of this patent
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Abstract
A method for processing a thermoset resin mixed with inorganic fibers; said method comprising combining a thermoset resin, an inorganic fiber and water to produce a dispersion.
Claims4
A method for processing a thermoset resin mixed with inorganic fibers;
- said method comprising a) combining a thermoset resin comprising at least one epoxy resin, wherein at least one epoxy resin is an oxazolidone epoxy resin, and water to produce an aqueous resin dispersion, b) at a temperature of 20 to 95° C., combining said aqueous resin dispersion in an extruder with an inorganic fiber having an arithmetic average length of 0.1 to 50 mm to form an aqueous resin and fiber dispersion, c) in the extruder, removing water from the aqueous resin and fiber dispersion to produce a molding compound having a residual water content of less than 2 wt %, d) before or after step c), adding an epoxy curing agent comprising a hardener and a catalyst to the extruder, wherein the hardener is dicyandiamide and the catalyst is a blocked urea and e) extruding the molding compound.
Dependencies are inferred from the claim text.