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US 11,363,372 B2Granted
Systems and methods for minimizing vibration sensitivity for protected microphones
AssigneeGoPro, Inc.
InventorsJoyce Gorny, Erich Tisch, Mark Hardin, Per Magnus Fredrik Hansson
Life of this patent
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Abstract
Protected microphone systems may include one or more dampeners, one or more cavities, or a combination thereof to minimize the vibration sensitivity of a microphone of the protected microphone systems. The dampeners, when present, may be constructed of a foam material or a thin metal material.
Claims20
An image capture device comprising:
- a housing;
- an audio capture device configured to obtain an audible sound;
- a printed circuit board (PCB) coupled to the audio capture device;
- a protective layer coupled to an internal portion of the housing;
- and
- a dampener configured to absorb vibration energy, wherein a first surface of the dampener directly contacts the protective layer and a second surface of the dampener is coupled to the PCB.
3 more elements
An audio capture device comprising:
- a housing that includes a first port fluidly connected to an external environment relative to the image capture device and a second port spaced from and fluidly connected to the first port;
- a protective layer disposed between the first port and the second port;
- a circuit board comprising a microphone configured to obtain an audible sound via the second port;
- a first cavity that extends between the first port and a first surface of the protective layer;
- a second cavity that extends between a second surface of the protective layer, the second port, and the microphone;
- and
- a dampener disposed between the circuit board and the protective layer, wherein a first surface of the dampener directly contacts the protective layer and a second surface of the dampener is coupled to the circuit board.
4 more elements
An image capture system comprising:
- a housing;
- a printed circuit board (PCB) disposed in the housing;
- an audio capture device coupled to the PCB configured to obtain an audible sound;
- a protective layer coupled to an internal portion of the housing;
- a dampener configured to absorb vibration energy, wherein a first surface of the dampener is coupled to the PCB;
- and
- an adhesive layer configured to attach the protective layer to a second surface of the dampener.
4 more elements
Dependencies are inferred from the claim text.