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US 11,361,878 B2Granted
Method for manufacturing insulating film and semiconductor package
AssigneeLG Chem, Ltd.
InventorsWoo Jae Jeong, You Jin Kyung, Byung Ju Choi, Bo Yun Choi, Kwang Joo Lee, Min Su Jeong
Life of this patent
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Abstract
The present invention relates to a method for manufacturing an insulating layer which can minimize the degree of warpage caused by polymer shrinkage at the time of curing and secure the stability of a semiconductor chip located therein, and a method for manufacturing a semiconductor package using an insulating layer obtained from the manufacturing method of the insulating layer.
Claims17
A method for manufacturing an insulating layer, comprising:
- sealing at least two or more semiconductor elements between a photosensitive resin layer and a polymer resin layer, wherein the polymer resin layer is formed on a substrate and contains an alkali-soluble resin and a heat-curable binder;
- exposing to light and alkali-developing the photosensitive resin layer to form a photosensitive resin block,
- alkali-developing an exposed polymer resin layer by the photosensitive resin block to form a polymer resin block;
- and
- curing the polymer resin block to form the insulating layer,
- wherein in the alkali developing step, at least one semiconductor element is sealed between the photosensitive resin block and the polymer resin block which are in contact with each other, and
- wherein a maximum longitudinal cross-sectional diameter of the polymer resin block is 50% or less with respect to a maximum longitudinal cross-sectional length of the polymer resin layer.
4 more elements
Dependencies are inferred from the claim text.