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US 11,357,105 B2Granted
Method for producing a printed circuit board
AssigneeNextGin Technology BV
InventorJ. A. A. M. Tourne
Life of this patent
Estimating the term…
Abstract
A method for producing a printed circuit board is disclosed, In the method, a slot is formed in a substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. Then, the conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.
Claims15
A method for making a printed circuit board, comprising the steps of:
- forming a slot in a substrate, the substrate having a first side and a second side and having at least three layers, with the slot extending through at least two of the at least three layers from the first side and terminating prior to intersecting the second side of the substrate such that the slot is blind, the substrate having multiple layers of traces and insulators including an internal trace, the slot having a length, depth, and a width, with the length being greater than the width, the slot having a first end and a second end, the first end and the second end having a semi-circular shape, the slot having a perimeter sidewall, wherein at least a portion of the perimeter sidewall is linear along the length of the slot, the slot being formed by a routing method;
- coating the perimeter sidewall of the substrate surrounding the slot with a conductive layer;
- and
- separating the conductive layer into at least two conductive segments that are electrically isolated along the perimeter sidewall of the substrate for providing an electrical connection between the internal trace and another internal or external trace.
1 more element
Dependencies are inferred from the claim text.