Curable semiconducting composition
AssigneeDow Global Technologies LLC
InventorsYichi Zhang, Timothy J. Person, Shrikant Dhodapkar, Remi A. Trottier
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Abstract
A rubberless, strippable, semiconducting composition that includes an ethylene-(carboxylic ester) copolymer having a low comonomeric unit content, carbon black, and a strippability additive combination comprising an amide wax and a silicone oil. Also provided are a cured product made from the composition, methods of making and using same, and articles containing same.
Claims10
A peroxide-curable semiconducting composition comprising 50 to 78 weight percent (wt %) of (A) a crosslinkable ethylene-vinyl acetate copolymer, having a vinyl acetate monomeric unit content of from 25 to 40 wt % (crosslinkable host copolymer);
- 20 to 48 wt % of (B) carbon black;
- 0.1 to 2.5 wt % of (C) an amide wax;
- 0.1 to 2.5 wt % of (D) a silicone oil;
- wherein the sum of wt % (C)+wt % (D) is from 1.0 to 5.0 wt %;
- 0.1 to 1.5 wt % of (E) an antioxidant comprising bis(4-(1-methyl-1-phenylethyl)phenyl)amine;
- and 0.1 to 1.5 wt % of (F) an organic peroxide;
- wherein all wt % are based on total weight of the peroxide-curable semiconducting composition and wherein total weight of the peroxide-curable semiconducting composition is 100.0 wt %;
- wherein the composition is free of each of the following materials:
- nitrile butadiene rubber;
- ethylene-propylene-based rubber;
- a phenol;
- a quinone;
- a thiazole;
- a thiuram sulfide;
- and a hydrocarbon wax.
Dependencies are inferred from the claim text.