Electrolytic copper foil, method for producing same, and high-capacity Li secondary battery negative electrode including same
AssigneeSK Nexilis Co., Ltd.
InventorsSeung Min Kim, Ho Gun Kim
Life of this patent
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AssigneeSK Nexilis Co., Ltd.
InventorsSeung Min Kim, Ho Gun Kim
Estimating the term…
The present invention relates to an electrolytic copper foil current collector where the surface properties are controlled to achieve a high adhesiveness to a negative electrode material. An electrolytic copper foil has a first surface and the second surface, the electrolytic copper foil comprising a first protective layer on the first surface side, a second protective layer on the second surface side, and a copper film between the first and second protective layers, wherein the coupling coefficient at the first surface or second surface of the electrolytic copper foil is 1.5 to 9.4 as represented by coupling coefficient=Rp/μm+ peak density/30+ amount of Cr adhesion/(mg/m2) (here, peak density is measured according to ASME standard B46.1). The electrolytic copper foil has a high adhesiveness to a negative electrode material and a low electrical resistance can be provided by controlling the surface properties of the electrolytic copper foil surface.
An electrolytic copper foil having a first surface and a second surface, the electrolytic copper foil comprising:
A method of manufacturing an electrolytic copper foil, the method comprising:
Dependencies are inferred from the claim text.