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US 11,346,000 B2Granted
Method for patterning a metal on a substrate and articles comprising same
AssigneeScodix Ltd.
InventorGregory Nakhmanovich
Life of this patent
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Abstract
A method for patterning a metal layer on a substrate is disclosed. Furthermore, a kit comprising a first composition comprising a reducing agent and a second composition comprising a metal salt, and an article comprising a substrate in contact with a metal layer are also disclosed.
Claims20
A method for patterning a metal layer on a substrate, comprising:
- (i) providing a substrate in contact with a cured composition comprising a reducing agent;
- and
- (ii) contacting said cured composition with a metal cation solution wherein the metal cation is reducible by said reducing agent and applying conditions sufficient for reduction of the metal cation by said reducing agent, wherein said conditions comprise exposure to UV-light;
- and wherein said contacting is performed in one-step;
- thereby patterning said metal layer on said substrate, wherein said metal layer is characterized by a gloss greater than 400 GU.
2 more elements
A method for patterning a metal layer on a substrate, comprising:
- (i) providing a substrate in contact with a cured composition comprising a reducing agent;
- and
- (ii) contacting said cured composition with a metal cation solution wherein the metal cation is reducible by said reducing agent, and applying conditions sufficient for reduction of the metal cation by said reducing agent, thereby patterning said metal layer on said substrate;
- wherein:
- said metal layer is characterized by a gloss greater than 400 GU;
- said conditions comprise exposure to UV-light and to a temperature between 50 and 250° C.;
- said contacting is performed in one-step;
- and
- said reducing agent comprises a dihydroxybenzene or a derivative thereof.
6 more elements
Dependencies are inferred from the claim text.