Method of embedding opto-electronic components in a layer

A method of embedding opto-electronic components in a layer, wherein the components are disposed beside one another to be spaced apart on a carrier, comprising:

• providing a molding tool having a bearing plate, wherein the bearing plate on a lower side comprises resilient bearing regions,
• bringing the bearing plate by way of the resilient bearing regions to bear on upper sides of the components,
• filling an intermediate space between the components, the carrier, and the bearing plate with a molding material, curing the molding material to form the layer, and
• removing the molding tool from the layer and the embedded components,
• wherein the molding tool comprises a compression plate, the compression plate on a lower side comprises bearing elements, the bearing elements are mutually spaced apart, the compression plate by way of the bearing elements bears on an upper side of the bearing plate, and when filling the molding material into the intermediate space the compression plate by way of the bearing elements presses the bearing plate against the components,
• the bearing elements have the form of pins lead out of a lower side of the compression plate,
• the bearing elements are disposed on an upper side of the bearing plate, and
• the bearing elements are disposed laterally of the components in the regions between the components.