Articles for lapping stacked row bars having in-wafer ELG circuits

An assembly for lapping multiple row bars, the assembly comprising:

• a carrier comprising at least one carrier bond pad;
• multiple row bars adjacent to each other in a stack, wherein a first row bar of the stack is positioned closer to the carrier than any of the other multiple row bars of the stack and comprises at least one row bar bond pad;
• at least one electrical connector, wherein each electrical connector comprises a proximal end attached to one of the carrier bond pads and a distal end attached to one of the row bar bond pads of the first row bar;
• and
• at least one electrical trace extending through at least two of the multiple row bars and electrically connecting at least the first row bar and one additional row bar of the stack;
• wherein an outermost row bar of the stack comprises an outer surface and at least one electronic lapping guide.