Filtered feedthrough assembly having a capacitor ground metallization electrically connected to the gold braze portion sealing a ferrule peninsula to a matching insulator cutout

A hermetically sealed filtered feedthrough assembly attachable to an active implantable medical device (AIMD), the filtered feedthrough assembly comprising:

• a) a hermetic feedthrough, comprising:
• i) a metallic and electrically conductive ferrule configured to be installed in an opening of a housing of an AIMD, the ferrule having a ferrule body fluid side opposite a ferrule device side and comprising a ferrule opening extending to the ferrule body fluid and device sides, wherein the ferrule comprises a peninsula extending into the ferrule opening;
• ii) an insulator disposed at least partially within the ferrule opening, the insulator comprising an insulator device side corresponding to the ferrule device side opposite an insulator body fluid side corresponding to the ferrule body fluid side, the insulator having a cutout matching the shape of the peninsula of the ferrule;
• iii) at least one active via hole in the insulator extending to the insulator body fluid and device sides;
• iv) an electrically conductive material disposed within and hermetically sealing the at least one active via hole;
• and
• v) a gold braze hermetically sealing the insulator to the ferrule including the ferrule peninsula received in the insulator cutout;
• b) an internally grounded feedthrough capacitor disposed on or adjacent to the ferrule and insulator first device sides, the internally grounded feedthrough capacitor comprising:
• i) at least one active electrode plate and at least one ground electrode plate disposed in a capacitive relationship within a capacitor dielectric substrate having a dielectric constant, k, that is greater than zero but less than 1000;
• ii) a first passageway and a second passageway extending through the capacitor dielectric substrate;
• iii) a capacitor active metallization disposed within the first passageway and being electrically connected to the at least one active electrode plate;
• iv) a capacitor first ground metallization disposed within the second passageway and being electrically connected to the at least one ground electrode plate;
• and
• v) a capacitor second ground metallization disposed on at least a portion of an outer surface of the capacitor dielectric substrate and being electrically connected to the at least one ground electrode plate,
• vi) wherein a portion of the gold braze along a perimeter of the peninsula of the ferrule and the cutout of the insulator is spatially aligned directly under the capacitor first ground metallization disposed within the second passageway of the internally grounded feedthrough capacitor;
• c) an active electrical connection electrically connecting the capacitor active metallization to the electrically conductive material disposed in the at least one active via hole extending through the insulator;
• d) a first ground electrical connection directly contacting both the spatially aligned portion of the gold braze along the perimeter of the peninsula of the ferrule and the capacitor first ground metallization disposed within the second passageway of the internally grounded feedthrough capacitor;
• and
• e) a second ground electrical connection electrically connecting at least a portion of the capacitor second ground metallization disposed on the outer surface of the capacitor dielectric substrate and being electrically connected to the at least one ground electrode plate to the gold braze.