Method of fabricating and method of using porous wafer battery
AssigneeXnrgi, Inc.
InventorsGerard Christopher D'Couto, Slobodan Petrovic
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Abstract
A method of fabricating a porous wafer battery comprises the steps of providing a silicon wafer comprising a plurality of pores; applying a first metallization process; applying a passivation process; applying solder balls, aligning the silicon wafer with a substance, and applying a solder reflow process. A method using a porous wafer battery comprises the steps of connecting the porous wafer battery to a plurality of sensors, a plurality of switches, and a battery management system; monitoring temperature, resistance, or current; and electrically disconnecting a non-properly functioning pore.
Claims15
A fabrication method of fabricating a porous wafer battery, the fabrication method comprising the steps of:
- providing a silicon wafer comprising
- a first side;
- a second side opposite the first side;
- and
- a plurality of pores, the plurality of pores being through holes extending from the first side of the silicon wafer to the second side of the silicon wafer;
- applying a first metallization process so that a first respective metal section of a first plurality of metal sections covers a portion of side walls of each pore of the plurality of pores and a portion of side walls of an adjacent pore of each pore of the plurality of pores;
- applying a passivation process forming a plurality of passivation sections;
- applying a respective solder ball of a plurality of solder balls at each pore of the plurality of pores;
- aligning the silicon wafer with a substrate comprising a plurality of contact bumps;
- and
- applying a solder reflow process so that a respective contact bump of the plurality of contact bumps is attached to each solder ball of the plurality of solder balls.
Dependencies are inferred from the claim text.