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US 11,342,160 B2Granted
Filter for impedance matching
AssigneeReno Technologies, Inc.
InventorsMichael Gilliam Ulrich, Ronald Anthony Decker
Life of this patent
Estimating the term…
Abstract
In one embodiment, an RF impedance matching network for a plasma chamber is disclosed. The matching network includes an electronically variable capacitor (EVC) comprising discrete capacitors, each discrete capacitor having a corresponding switching circuit for switching in and out the discrete capacitor to alter a total capacitance of the EVC. Each switching circuit includes a diode operably coupled to the discrete capacitor to cause the switching in and out of the discrete capacitor, and a filter circuit parallel to the diode, the filter comprising a filtering capacitor in series with an inductor.
Claims20
A matching network comprising:
- a radio frequency (RF) input configured to be operably coupled to an RF source;
- an RF output configured to be operably coupled to a plasma chamber;
- an electronically variable capacitor (EVC) comprising discrete capacitors, each discrete capacitor having a corresponding switching circuit for switching in and out the discrete capacitor to alter a total capacitance of the EVC;
- wherein each switching circuit comprises:
- a diode having a first terminal operably coupled to the discrete capacitor and a second terminal operably coupled to a common ground, the diode configured to cause the switching in and out of the discrete capacitor;
- and
- a driver circuit;
- a choke inductor having a first terminal operably coupled to the driver circuit and a second terminal operably coupled to the diode;
- and
- a filter circuit comprising a filtering capacitor in series with a filtering circuit inductor, a first terminal of the filter circuit being operably coupled between the driver circuit and the first terminal of the choke inductor, and a second terminal of the filter circuit being operably coupled to the common ground;
- wherein the common ground is further operably coupled to a biasing current supply.
8 more elements
A method of matching an impedance comprising:
- coupling an RF input of a matching network to an RF source;
- coupling an RF output of the matching network to a plasma chamber, wherein the matching network comprises an electronically variable capacitor (EVC) comprising discrete capacitors, each discrete capacitor having a corresponding switching circuit configured to switch in and out the discrete capacitor, wherein each switching circuit comprises:
- a diode having a first terminal operably coupled to the discrete capacitor and a second terminal operably coupled to a common ground, the diode configured to cause the switching in and out of the discrete capacitor;
- and
- a driver circuit;
- a choke inductor having a first terminal operably coupled to the driver circuit and a second terminal operably coupled to the diode;
- and
- a filter circuit comprising a filtering capacitor in series with a filtering circuit inductor, a first terminal of the filter circuit being operably coupled between the driver circuit and the first terminal of the choke inductor, and a second terminal of the filter circuit being operably coupled to the common ground;
- coupling the common ground to a biasing current supply;
- matching an impedance by at least one of the switching circuits of the EVC switching in or out its corresponding discrete capacitor to alter a total capacitance of the EVC.
7 more elements
A semiconductor processing tool comprising:
- a plasma chamber configured to deposit a material onto a substrate or etch a material from the substrate;
- and
- an impedance matching network operably coupled to the plasma chamber, the matching network comprising:
- an RF input configured to be operably coupled to an RF source;
- an RF output operably coupled to the plasma chamber;
- and
- an electronically variable capacitor (EVC) comprising discrete capacitors, each discrete capacitor having a corresponding switching circuit for switching in and out the discrete capacitor to alter a total capacitance of the EVC;
- wherein each switching circuit comprises:
- a diode having a first terminal operably coupled to the discrete capacitor and a second terminal operably coupled to a common ground, the diode configured to cause the switching in and out of the discrete capacitor;
- and
- a driver circuit;
- a choke inductor having a first terminal operably coupled to the driver circuit and a second terminal operably coupled to the diode;
- and
- a filter circuit comprising a filtering capacitor in series with a filtering circuit inductor, a first terminal of the filter circuit being operably coupled between the driver circuit and the first terminal of the choke inductor, and a second terminal of the filter circuit being operably coupled to the common ground;
- wherein the common ground is further operably coupled to a biasing current supply.
12 more elements
A method of fabricating a semiconductor, the method comprising:
- placing a substrate in a plasma chamber configured to deposit a material layer on the substrate or etch a material layer from the substrate;
- energizing plasma within the plasma chamber by coupling RF power from an RF source to the plasma chamber to perform the deposition or etching;
- and
- while energizing the plasma, carrying out an impedance match by an impedance matching network coupled between the plasma chamber and the RF source, the matching network comprising:
- an RF input operably coupled to the RF source;
- an RF output operably coupled to the plasma chamber;
- and
- an electronically variable capacitor (EVC) comprising discrete capacitors, each discrete capacitor having a corresponding switching circuit for switching in and out the discrete capacitor to alter a total capacitance of the EVC;
- wherein each switching circuit comprises:
- a diode having a first terminal operably coupled to the discrete capacitor and a second terminal operably coupled to a common ground, the diode configured to cause the switching in and out of the discrete capacitor;
- and
- a driver circuit;
- a choke inductor having a first terminal operably coupled to the driver circuit and a second terminal operably coupled to the diode;
- and
- a filter circuit comprising a filtering capacitor in series with a filtering circuit inductor, a first terminal of the filter circuit being operably coupled between the driver circuit and the first terminal of the choke inductor, and a second terminal of the filter circuit being operably coupled to the common ground;
- wherein the common ground is further operably coupled to a biasing current supply.
13 more elements
Dependencies are inferred from the claim text.