Dry film formulation
AssigneeFunai Electric Co., Ltd.
InventorSean T. Weaver
Life of this patent
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Abstract
An improved photoimageable dry film formulation, a fluidic ejection head containing a thick film layer derived from the improved photoimageable dry film formulation, and a method for making a fluidic ejection head. The improved photoimageable dry film formulation includes a multifunctional epoxy compound, a photoinitiator capable of generating a cation, a non-photoreactive solvent, and from about 0.5 to about 5% by weight a silane oligomer adhesion enhancer based on a total weight of the photoimageable dry film formulation before drying.
Claims14
An improved photoimageable dry film formulation, the dry film formulation comprising a multifunctional epoxy compound, a photoinitiator capable of generating a cation, a non-photoreactive solvent, and from about 0.5 to about 5% by weight a silane oligomer adhesion enhancer based on a total weight of the photoimageable dry film formulation before drying, wherein the silane oligomer adhesion enhancer is a gamma-glycidoxypropyltrimethoxysilane oligomer of the formula
- wherein n ranges from 1 to 4.
A method for making an improved fluidic ejection head, the method comprising the steps of:
- applying a photoresist layer to a release film, wherein the photoresist layer is derived from a photoimageable dry film formulation comprising a multi-functional epoxy compound, a photoacid generator, a silane oligomer adhesion enhancer is a gamma-glycidoxypropyltrimethoxysilane oligomer of the formula
- wherein n ranges from 1 to 4, and an aryl ketone solvent;
- drying the photoimageable dry film formulation on the release film layer to provide a thick film layer;
- laminating the thick film layer to a flow feature layer on a semiconductor substrate;
- removing the release film from the thick film layer;
- imaging a nozzle hole in the thick film layer;
- and
- developing the imaged thick film layer to provide a nozzle plate for the fluidic ejection head.
A fluidic ejection head for ejecting a fluid composition comprising:
- a semiconductor substrate containing fluid ejection devices thereon,
- a flow feature layer disposed on the semiconductor substrate, and
- a thick film layer laminated to the flow feature layer, wherein the thick film layer is derived from a photoimageable dry film formulation comprising a multifunctional epoxy compound, a photoinitiator capable of generating a cation, a non-photoreactive solvent, and from about 0.5 to about 5% by weight a silane oligomer adhesion enhancer based on a total weight of the photoimageable dry film formulation before drying, wherein the silane oligomer adhesion enhancer is a gamma-glycidoxypropyltrimethoxysilane oligomer of the formula
- wherein n ranges from 1 to 4.
Dependencies are inferred from the claim text.