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US 11,339,493 B2Granted
Systems and methods of controlling electroplating
AssigneeShenzhen Xpectvision Technology Co., Ltd.
InventorsPeiyan Cao, Yurun Liu
Life of this patent
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Abstract
Disclosed herein is a system, comprising: a detector configured to determine a number of photons of one or more characteristic X-rays emitted by a chemical element in the electrolyte and received by the detector, within a period of time; a processor configured to determine a concentration of the chemical element in the electrolyte based on the number; a controller configured to replenish the chemical element into the electrolyte or configured to stop electroplating with the electrolyte, based on the concentration.
Claims22
A system comprising:
- a detector configured to determine a number of photons of one or more characteristic X-rays emitted by a chemical element in an electrolyte and received by the detector, within a period of time;
- a processor configured to determine a concentration of the chemical element in the electrolyte based on the number;
- a controller configured to replenish the chemical element into the electrolyte or configured to stop electroplating with the electrolyte, based on the concentration.
A method comprising:
- determining a number of photons of one or more characteristic X-rays emitted by a chemical element in an electrolyte within a period of time, while a workpiece is electroplated in the electrolyte;
- determining a concentration of the chemical element in the electrolyte based on the number;
- replenishing the chemical element in the electrolyte or stopping electroplating the workpiece in the electrolyte, based on the concentration.
Dependencies are inferred from the claim text.