Semiconductor optical device
AssigneeLumentum Japan, Inc.
InventorKoichiro Adachi
Life of this patent
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Abstract
A semiconductor optical device includes: a laser for emitting light; a modulator for modulating the light using an electroabsorption effect; a chip capacitor that is electrically connected in parallel to the laser; a chip inductor that is electrically connected in series to the chip capacitor, is electrically connected in series to the laser and the chip capacitor as a whole, and includes a first terminal and a second terminal; a solder or a conductive adhesive that directly bonds the first terminal of the chip inductor and the chip capacitor to each other; an electrical wiring group in which the laser, the modulator, the chip capacitor, and the chip inductor are electrically connected to each other; and a substrate on which the laser, the modulator, the chip capacitor, and the chip inductor are mounted.
Claims20
A semiconductor optical device comprising:
- a laser for emitting light;
- a modulator for modulating the light using an electroabsorption effect;
- a chip capacitor that is electrically connected in parallel to the laser;
- a chip inductor that is electrically connected in series to the chip capacitor, electrically connected in series to the laser and the chip capacitor, and includes a first terminal and a second terminal;
- a solder or a conductive adhesive that directly bonds the first terminal of the chip inductor and the chip capacitor to each other;
- an electrical wiring group in which the laser, the modulator, the chip capacitor, and the chip inductor are electrically connected to each other;
- and
- a substrate on which the laser, the modulator, the chip capacitor, and the chip inductor are mounted.
A device comprising:
- a laser for emitting light;
- a modulator for modulating the light;
- a chip capacitor that is electrically connected in parallel to the laser;
- a chip inductor that is electrically connected in series to the chip capacitor, electrically connected in series to the laser and the chip capacitor, and includes a first terminal and a second terminal,
- wherein the first terminal of the chip inductor and the chip capacitor are bonded to each other;
- and
- an electrical wiring group in which the laser, the modulator, the chip capacitor, and the chip inductor are electrically connected to each other.
Dependencies are inferred from the claim text.