Touch control device and manufacturing method thereof
AssigneesInterface Technology (ChengDu) Co., Ltd., Interface Optoelectronics (Shenzhen) Co., Ltd., Interface Optoelectronics (Wuxi) Co., Ltd., General Interface Solution Limited
InventorHan Lung Tsai
Life of this patent
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Abstract
A touch device comprises a housing, a touch sensor and a circuit board. The housing has an inner space and an opening. The touch sensor is arranged in the inner space, and comprises a substrate, first metal pads and a sensing layer. The substrate is arranged in the inner space and corresponding to the shape of the housing. The sensing layer is arranged on the substrate and electrically connected to the first metal pads. The circuit board is arranged on the housing at a position adjacent to the opening, and comprises second metal pads facing towards the inner space and electrically connected to the first metal pads, respectively. The provided touch device can achieve full-screen touch control without the need for reserving a bezel to lay out wires.
Claims26
A touch device, comprising:
- a housing, having an inner space and an opening, wherein the opening is connected to the inner space;
- a touch sensor, arranged in the inner space and comprising:
- a substrate, arranged in the inner space and corresponding to the shape of the housing;
- and
- a plurality of first metal pads, arranged on the substrate;
- and
- a sensing layer, arranged on the substrate and electrically connected to the plurality of first metal pads;
- and
- a circuit board, arranged on the housing at a position adjacent to the opening, wherein the circuit board has a plurality of second metal pads facing towards the inner space and electrically connected to the plurality of first metal pads, respectively.
A method for manufacturing a touch device, comprising the following steps:
- forming a plurality of first metal pads and a sensing layer on a substrate to produce a touch sensor, wherein the sensing layer is connected to the plurality of first metal pads;
- placing the touch sensor into a mold for thermoforming, in order to produce a three-dimensional (3D) touch sensor, wherein the plurality of first metal pads are located on the inner side of the three-dimensional touch sensor;
- forming a three-dimensional housing on the outer side of the three-dimensional touch sensor by injection molding;
- and
- electrically connected to a plurality of second metal pads of a circuit board to the plurality of first metal pads, respectively.
Dependencies are inferred from the claim text.