Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern
AssigneeAsahi Kasei Kabushiki Kaisha
InventorsEiichi Ohno, Toru Yumoto, Masanori Tsuruta
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Abstract
A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2). 0.0001≤(reductant mass/copper oxide mass)≤0.10 (1) 0.0050≤(dispersing agent mass/copper oxide mass)≤0.30 (2) The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.
Claims13
A structure with a conductive pattern comprising:
- a board;
- a cuprous-oxide-containing layer formed on a surface of the board;
- and
- a conductive layer formed on a surface of the cuprous-oxide-containing layer,
- wherein the conductive layer is a wiring having a wire width of 1 μm or more to 1000 μm or less, and the wiring contains a reduced copper.
A structure with a conductive pattern comprising:
- a board;
- and
- a conductive pattern formed on a surface of the board,
- wherein the conductive pattern is a wiring having a wire width of 1 μm or more to 1000 μm or less, and the wiring contains a reduced copper, a phosphorus, and a void.
A structure with a conductive pattern comprising:
- a board;
- and
- a conductive pattern formed on the board surface,
- wherein the conductive pattern is a wiring having a wire width of 1 μm or more to 1000 μm or less, the wiring contains a reduced copper, a copper oxide, and a phosphorus, and a resin is disposed so as to cover the wiring.
A method for manufacturing a structure with a conductive pattern comprising:
- a step of applying a dispersing element over a board to form an application film;
- and
- a step of irradiating the application film with laser light to form a conductive pattern on the board,
- wherein the dispersing element includes a copper oxide, a dispersing agent, and a reductant,
- wherein content of the reductant is in a range of a following formula (1), and
- wherein content of the dispersing agent is in a range of a following formula (2):
- 0.0001≤(reductant mass/copper oxide mass)≤0.10 (1)
- 0.0050≤(dispersing agent mass/copper oxide mass)≤0.30 (2).
Dependencies are inferred from the claim text.