Surface modification device
AssigneeKasuga Denki, Inc.
InventorsSatoshi Sugimura, Satoru Ogiso, Yukihira Sakurai, Junya Yoshida, Takao Morishita
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AssigneeKasuga Denki, Inc.
InventorsSatoshi Sugimura, Satoru Ogiso, Yukihira Sakurai, Junya Yoshida, Takao Morishita
Estimating the term…
Surface modification device forms a discharge area E1 between a discharge electrode 6 and a counter electrode 4, supplies substitution gas to the discharge area E1, and modifies the surface of the base material to be processed. The surface modification device comprises; a slit-shaped substitution gas passage; and cover members 7, 8 that form curtain passages 22, 23 in spaces facing the discharge electrode. While the substitution gas is being supplied to the discharge area E1, gas injected from the curtain passages 22, 23 prevent the inflow of an entrained flow a and the outflows b1, b2 of the substitution gas, thereby maintaining the concentration of substitution gas inside the discharge area E1.
A surface modification device, configured to supply substitution gas to a discharge area that is formed between a discharge electrode, which has a length in a width direction of a base material and includes one or more electrode members, and a counter electrode facing the discharge electrode, in order for a surface of the base material to be treated by discharge energy, the surface modification device comprising:
A surface modification device, configured to supply substitution gas to a discharge area that is formed between a discharge electrode, which has a length in a width direction of a base material and includes one or more electrode members, and a counter electrode facing the discharge electrode, in order for a surface of the base material to be treated by discharge energy, the surface modification device comprising:
Dependencies are inferred from the claim text.