Methods of manufacture of microisolators and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors

A method for manufacturing a microisolator, comprising the steps of:

• obtaining a base for adhesion to a mesh damper;
• applying an effective amount of adhesive to a bottom surface of the mesh damper and allowing the effective amount of adhesive to penetrate the mesh damper for a first predetermined period of time, wherein the effective amount of adhesive is in substantially liquid form during application;
• positioning the mesh damper atop the base such that the bottom surface of the mesh damper is substantially in contact with a top surface of the base;
• performing an ovenization process comprising heating the base and the mesh damper to a reflow temperature for a second predetermined period of time;
• allowing the base and the mesh damper to cool, wherein heating and then cooling the base and the mesh damper causes the mesh damper to bond to the base via the effective amount of adhesive;
• subsequent to allowing the base and the mesh damper to cool, applying a second effective amount of adhesive to a top surface of the mesh damper and allowing the second effective amount of adhesive to penetrate the mesh damper for the first predetermined period of time, wherein the second effective amount of adhesive is in substantially liquid form during application;
• positioning an isolator platform atop the mesh damper such that a bottom surface of the isolator platform is substantially in contact with the top surface of the mesh damper;
• subsequent to positioning the isolator platform atop the mesh damper and prior to performing a second ovenization process, inverting the isolator platform, the mesh damper, and the base such that the top surface of the mesh damper is superior to the bottom surface of the isolator platform;
• performing the second ovenization process comprising heating the isolator platform, the mesh damper, and the base to the reflow temperature for the second predetermined period of time, wherein the inversion of the isolator platform, the mesh damper, and the base causes, during the second ovenization process, a soldering paste flow direction to run downward from the top surface of the mesh damper to the bottom surface of the isolator platform;
• and
• allowing the isolator platform, the mesh damper, and the base to cool, wherein heating and then cooling the isolator platform, the mesh damper, and the base causes the mesh damper to bond to the isolator platform via the second effective amount of adhesive.