# US 11,310,943 B1 · Cooling system for rack mounted electronic components > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,310,943 B1 - Document ID: US11310943B1 - Status: Granted - Kind: B1 - Application number: 16/950,128 - Filed: 2020-11-17 - Granted: 2022-04-19 - Earliest claimed: 2018-12-31 - Assignees: United Services Automobile Association (USAA) - Applicants: Uipco, LLC - Inventors: Bryan J. Osterkamp; Ryan Thomas Russell; William Preston Culbertson, II; Nathan Lee Post; Courtney St. Martin; Ashley Raine Philbrick - Web page: https://patentgrep.com/patent/US11310943B1 ## CPC - H05K 7/20736: {within cabinets for removing heat from server blades} - H05K 7/1489: {characterized by the mounting of blades therein, e.g. brackets, rails, trays (H05K7/1491 takes precedence)} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A system to improve cooling of rack mounted components may include a first rack mounted component including a first motherboard, the first motherboard having a first edge and a second rack mounted component disposed above the first rack mounted component; the second rack mounted component having a second motherboard having a first edge, wherein the second motherboard is similar to the first motherboard. The second motherboard may be disposed above the first motherboard, and wherein the second motherboard is angled with respect to the first motherboard so that the first edge of the second motherboard is non-aligned with the first edge of the first motherboard. In addition, the first motherboard may be arranged horizontally in a first plane and the second mother board may be arranged horizontally in a second plane that is parallel to the first plane. ## Claims ### Claim 1 A system to improve cooling of rack mounted components, comprising: a first rack mounted component including a first motherboard, the first motherboard having a first edge; and a second rack mounted component disposed above the first rack mounted component; the second rack mounted component having a second motherboard having a first edge, wherein the second motherboard is similar to the first motherboard; wherein the second motherboard is disposed above the first motherboard, and wherein the second motherboard is angled with respect to the first motherboard so that the first edge of the second motherboard is non-aligned with the first edge of the first motherboard; and wherein the first motherboard is arranged horizontally in a first plane and the second mother board is arranged horizontally in a second plane that is parallel to the first plane. ### Claim 2 (depends on 1) The system according to claim 1, further comprising a third rack mounted component disposed above the second rack mounted component; the third rack mounted component having a third motherboard, wherein the third motherboard is similar to the first motherboard; the third motherboard having a first edge. ### Claim 3 (depends on 2) The system according to claim 2, wherein the third motherboard is disposed above the second motherboard, and wherein the third motherboard is angled with respect to the second motherboard so that the first edge of the third motherboard is non-aligned with the first edge of the second motherboard. ### Claim 4 (depends on 3) The system of claim 3, wherein the third motherboard is arranged horizontally in a third plane that is parallel to the first plane and the second plane. ### Claim 5 (depends on 1) The system according to claim 1, further including a vertical flow fan disposed beneath the first rack mounted component. ### Claim 6 (depends on 1) The system according to claim 1, wherein the first rack mounted component includes an air permeable base that substantially permits vertical air flow through the first rack mounted component. ### Claim 7 (depends on 6) The system according to claim 6, wherein the second rack mounted component includes an air permeable base that substantially permits vertical air flow through the second rack mounted component. ### Claim 8 (depends on 1) The system according to claim 1, wherein the first rack mounted component is a server. ### Claim 9 A system to improve cooling of rack mounted components, comprising: a first rack mounted component including a first motherboard, the first motherboard having a substantially rectangular shape; and a second rack mounted component disposed above the first rack mounted component; the second rack mounted component having a second motherboard having a substantially rectangular shape, wherein the second motherboard is similar to the first motherboard; wherein the second motherboard is disposed above the first motherboard, and wherein the second motherboard is angled with respect to the first motherboard so that edges of the substantially rectangular first motherboard are non-aligned with edges of the substantially rectangular second motherboard; and wherein the first motherboard is arranged horizontally in a first plane and the second mother board is arranged horizontally in a second plane that is parallel to the first plane. ### Claim 10 (depends on 9) The system according to claim 9, further comprising a third rack mounted component disposed above the second rack mounted component; the third rack mounted component having a third motherboard having a substantially rectangular shape, wherein the third motherboard is similar to the first motherboard; wherein the third motherboard is disposed above the second motherboard, and wherein edges of the substantially rectangular third motherboard are non-aligned with edges of the substantially rectangular second motherboard; wherein the third motherboard is arranged horizontally in a third plane that is parallel to the first plane and the second plane. ### Claim 11 (depends on 9) The system according to claim 9, further including a vertical flow fan disposed beneath the first rack mounted component. ### Claim 12 (depends on 9) The system according to claim 9, wherein the first rack mounted component is a server. ### Claim 13 A system to improve cooling of rack mounted components, comprising: a first rack mounted component including a first motherboard, the first motherboard having a first edge; and a second rack mounted component disposed above the first rack mounted component; the second rack mounted component having a second motherboard having a first edge, wherein the second motherboard is similar to the first motherboard; wherein the second motherboard is disposed above the first motherboard, and wherein the second motherboard is angled with respect to the first motherboard so that the first edge of the second motherboard is non-aligned with the first edge of the first motherboard; and wherein a relative orientation of the second motherboard with respect to the first motherboard creates a rotating airflow pattern as cooling air rises from the first motherboard to the second motherboard. ### Claim 14 (depends on 13) The system according to claim 13, further comprising a third rack mounted component disposed above the second rack mounted component; the third rack mounted component having a third motherboard, wherein the third motherboard is similar to the first motherboard; the third motherboard having a first edge. ### Claim 15 (depends on 14) The system according to claim 14, wherein the third motherboard is disposed above the second motherboard, and wherein the third motherboard is angled with respect to the second motherboard so that the first edge of the third motherboard is non-aligned with the first edge of the second motherboard. ### Claim 16 (depends on 13) The system according to claim 13, wherein the first motherboard is smaller than the first rack mounted component. ### Claim 17 (depends on 13) The system according to claim 13, further including a vertical flow fan disposed beneath the first rack mounted component. ### Claim 18 (depends on 13) The system according to claim 13, wherein the first rack mounted component includes an air permeable base that substantially permits vertical air flow through the first rack mounted component. ### Claim 19 (depends on 18) The system according to claim 18, wherein the second rack mounted component includes an air permeable base that substantially permits vertical air flow through the second rack mounted component. ### Claim 20 (depends on 13) The system according to claim 13, wherein the first rack mounted component is a server.