# US 11,310,941 B2 · Electronic device and heat sink > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,310,941 B2 - Document ID: US11310941B2 - Status: Granted - Kind: B2 - Application number: 17/029,443 - Filed: 2020-09-23 - Published: 2022-03-10 - Granted: 2022-04-19 - Earliest claimed: 2020-09-08 - Assignees: Inventec (Pudong) Technology Corporation; Inventec Corporation - Applicants: Inventec (Pudong) Technology Corporation; Inventec Corporation - Inventors: Kai-Yang Tung; Hung-Ju Chen - Web page: https://patentgrep.com/patent/US11310941B2 ## CPC - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - H10W 40/641: {Snap-on arrangements, e.g. clips} - G06F 1/20: Cooling means - H05K 7/20327: {Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds} - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 40/47: by flowing liquids, e.g. forced water cooling - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract The invention provides a heat sink. The heat sink is configured to be in thermal contact with a heat source. The heat sink includes a base portion, a plurality of fin portions, and a wall portion. The base portion includes a thermal contact surface and a rear surface. The thermal contact surface is configured to be in thermal contact with the heat source, and the rear surface faces away from the thermal contact surface. The fin portions protrude from the rear surface of the base portion. The wall portion protrudes from the rear surface of the base portion and surrounds the fin portions. In addition, the invention also provides an electronic assembly including the heat sink. ## Claims ### Claim 1 A heat sink, configured to be in thermal contact with a heat source, the heat sink comprising: a base portion, comprising a thermal contact surface, a rear surface, and a plurality of mount holes, wherein the thermal contact surface is configured to be in thermal contact with the heat source, and the rear surface faces away from the thermal contact surface, the plurality of mount holes penetrate through the thermal contact surface and the rear surface; a plurality of fin portions, protruding from the rear surface of the base portion; a wall portion, protruding from the rear surface of the base portion and surrounding the plurality of fin portions; and a plurality of partition portions, wherein the plurality of partition portions protrude from the rear surface and are respectively connected to different sides of the wall portion, the plurality of partition portions and the wall portion respectively surround the plurality of mount holes. ### Claim 2 (depends on 1) The heat sink according to claim 1, wherein the plurality of fin portions are spaced apart from the wall portion. ### Claim 3 (depends on 1) The heat sink according to claim 1, wherein the plurality of fin portions are connected to the wall portion. ### Claim 4 (depends on 1) The heat sink according to claim 1, wherein the plurality of fin portions are arranged in plural rows separated from each other, and the plurality of fin portions in each row are spaced apart from each other so that the plurality of fin portions form a plurality of longitudinal channels and a plurality of transverse channels intersecting each other in the wall portion. ### Claim 5 (depends on 1) The heat sink according to claim 1, wherein a height of each of the plurality of partition portions protruding from the rear surface is substantially equal to a height of each of the plurality of fin portions protruding from the rear surface. ### Claim 6 (depends on 1) The heat sink according to claim 1, wherein a height of the wall portion protruding from the rear surface is substantially equal to a height of each of the plurality of fin portions protruding from the rear surface. ### Claim 7 An electronic device, comprising: a casing, comprising an accommodation space; an electronic assembly, located in the accommodation space, wherein the electronic assembly comprises a circuit board and a heat source, the circuit board is mounted on the casing, and the heat source is mounted on the circuit board; a heat sink, located in the accommodation space, comprising: a base portion, comprising a thermal contact surface, a rear surface, and a plurality of mount holes, wherein the thermal contact surface is in thermal contact with the heat source, and the rear surface faces away from the thermal contact surface, the plurality of mount holes penetrate through the thermal contact surface and the rear surface; a plurality of fin portions, protruding from the rear surface of the base portion; a wall portion, protruding from the rear surface of the base portion and surrounding the plurality of fin portions; and a plurality of partition portions, wherein the plurality of partition portions protrude from the rear surface and are respectively connected to different sides of the wall portion, the plurality of partition portions and the wall portion respectively surround the plurality of mount holes; and a cover, comprising a plurality of through holes, wherein the plurality of through holes are configured for a passage of a coolant to drop on the heat sink. ### Claim 8 (depends on 7) The electronic device according to claim 7, wherein the plurality of fin portions are arranged in plural rows separated from each other, and the plurality of fin portions in each row are spaced apart from each other so that the plurality of fin portions form a plurality of longitudinal channels and a plurality of transverse channels intersecting each other in the wall portion.