# US 11,310,940 B2 · Electronic device including radiation structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,310,940 B2 - Document ID: US11310940B2 - Status: Granted - Kind: B2 - Application number: 16/766,661 - Filed: 2018-10-25 - Published: 2020-11-19 - Granted: 2022-04-19 - Earliest claimed: 2017-11-24 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Hong Ki Moon; Seung Hoon Kang; Yoon Sun Park; Kyung Ha Koo; In Kuk Yun; Se Young Jang; Hyo Seok Na - Web page: https://patentgrep.com/patent/US11310940B2 ## CPC - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - G06F 1/203: {for portable computers, e.g. for laptops} - H04B 1/3888: Arrangements for carrying or protecting transceivers - H05K 7/20136: {Forced ventilation, e.g. by fans (H05K7/202 takes precedence)} - H05K 7/20154: {Heat dissipaters coupled to components} - H05K 7/20336: {Heat pipes, e.g. wicks or capillary pumps} - H05K 7/20472: {Sheet interfaces} - H01Q 1/002: {Protection against seismic waves, thermal radiation or other disturbances, e.g. nuclear explosion; Arrangements for improving the power handling capability of an antenna} - H04B 1/036: Cooling arrangements - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H04B: TRANSMISSION - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract An electronic device according to various embodiments of the present invention can comprise: a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member for encompassing a space between the first plate and the second plate; a circuit board arranged inside the housing and including at least one heating element; a first vapor chamber for receiving, through conduction, and dispersing, in at least a partial space between the first plate and the circuit board, heat released from the at least one heating element; a heat sink for receiving, through conduction, and absorbing, in at least a partial space between the circuit board and the second plate, heat released from the at least one heating element; and a fan for supplying air such that the heat absorbed by the heat sink is forcibly convected toward the outside of the electronic device. Additional various embodiments are possible. ## Claims ### Claim 1 An electronic device comprising: a housing including a first plate facing a first direction, a second plate facing a second direction that is opposite to the first direction, and side members configured to surround a space between the first plate and the second plate; a bracket disposed in the space of the housing; a first graphite sheet disposed between the bracket and the first plate, the first graphite sheet being supported by the bracket and thermally combined with the first plate; a circuit board disposed between the bracket and the second plate in the space of the housing and including at least one heat generation element; a first vapor chamber configured to receive and diffuse a first portion of heat discharged from the at least one heat generation element, the first vapor chamber disposed at least some of a space between the bracket and the circuit board; a heat sink configured to receive and absorb a second portion of the discharged heat from the at least one heat generation element, the heat sink disposed in at least some of a space between the circuit board and the second plate; and a fan configured to blow air so that the absorbed second portion of the heat by the heat sink is forcibly moved toward an outside of the electronic device. ### Claim 2 (depends on 1) The electronic device of claim 1, further comprising a first thermal spreader configured to conduct the second portion of the discharged heat from the at least one heat generation element, wherein at least a portion of the first thermal spreader is disposed between the circuit board and the heat sink. ### Claim 3 (depends on 2) The electronic device of claim 2, further comprising a second vapor chamber disposed between the circuit board and the second plate, the second vapor chamber configured to: receive the second portion of the discharged heat from the at least one heat generation element through at least another portion of the first thermal spreader, and diffuse the second portion of the discharged heat. ### Claim 4 (depends on 3) The electronic device of claim 3, further comprising a supporting member configured to fix a position of the second vapor chamber, wherein at least a portion of the supporting member is disposed between the circuit board and the second vapor chamber. ### Claim 5 (depends on 3) The electronic device of claim 3, further comprising a second thermal spreader configured to conduct the conducted heat from the first thermal spreader to the second vapor chamber, wherein at least a portion of the second thermal spreader is disposed between the second vapor chamber and the second plate. ### Claim 6 (depends on 2) The electronic device of claim 2, further comprising: a thermal interface material configured to transmit the discharged heat from the at least one heat generation element to the first thermal spreader; and a nano foam having a shape surrounding edges of the thermal interface material. ### Claim 7 (depends on 1) The electronic device of claim 1, further comprising a second graphite sheet disposed in at least some of a space between the heat sink and the second plate. ### Claim 8 (depends on 1) The electronic device of claim 1, wherein the at least one heat generation element includes at least one of a communication modem, an RF element, an antenna module, or a processor. ### Claim 9 (depends on 1) The electronic device of claim 1, wherein the at least one heat generation element includes at least one of a processor or an antenna module that is configured to support a 5G communication system. ### Claim 10 (depends on 1) The electronic device of claim 1, wherein the first plate comprises a display.