# US 11,310,935 B2 · Heat dissipator and communications device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,310,935 B2 - Document ID: US11310935B2 - Status: Granted - Kind: B2 - Application number: 16/685,019 - Filed: 2019-11-15 - Published: 2020-03-12 - Granted: 2022-04-19 - Earliest claimed: 2017-05-17 - Assignees: Huawei Technologies Co., Ltd. - Applicants: Huawei Technologies Co., Ltd. - Inventors: Hui Jia - Web page: https://patentgrep.com/patent/US11310935B2 ## CPC - H05K 7/20154: {Heat dissipaters coupled to components} - F28D 1/035: {with U-flow or serpentine-flow inside the conduits (F28D1/0341 takes precedence)} - F28F 3/022: {the means being wires or pins} - F28F 3/12: Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} - H05K 7/20409: {Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing} - H10W 40/475: {using jet impingement (H10W40/776 takes precedence)} - F28D 2021/0029: {Heat sinks} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Embodiments of this application relate to a heat dissipator including a cover plate, an orifice plate, and a base plate that are stacked in sequence. A distribution cavity is disposed between the orifice plate and the cover plate, a heat exchange cavity is disposed between the orifice plate and the base plate, and the distribution cavity communicates with the heat exchange cavity by using through holes disposed on the orifice plate. A plurality of pin fins facing the orifice plate are disposed on a surface of the base plate in the heat exchange cavity, gaps between the plurality of pin fins constitute a fluid passage, and the pin fins include a combination pin fin in contact with the orifice plate, and a flow guiding pin fin that corresponds to the through hole and that has a gap with the through hole. ## Claims ### Claim 1 A heat dissipator, comprising: a cover plate; an orifice plate having a plurality of through holes disposed thereon; and a base plate, wherein the cover plate, the orifice plate, and the base plate are configured to be stacked in sequence, a distribution cavity is disposed between the orifice plate and the cover plate, a heat exchange cavity is disposed between the orifice plate and the base plate, the distribution cavity is configured to communicate with the heat exchange cavity by using the plurality of through holes disposed on the orifice plate, and a plurality of pin fins facing the orifice plate are disposed on a surface of the base plate in the heat exchange cavity, gaps between the plurality of pin fins constitute a fluid passage, and the plurality of pin fins comprise: a combination pin fin in contact with the orifice plate, and a first flow guiding pin fin associated with a through hole, from the plurality of through holes, and having a gap with the through hole, wherein the first flow guiding pin fin corresponds to an inflow cavity, from a plurality of inflow cavities, and a second flow guiding pin fin corresponding to an outflow cavity, from a plurality of outflow cavities, wherein a height of the first flow guiding pin fin is greater than a height of the second flow guiding pin fin. ### Claim 2 (depends on 1) The heat dissipator according to claim 1, wherein the gap between the first flow guiding pin fin and the through hole, from the plurality of through holes, is greater than or equal to 0.1 mm. ### Claim 3 (depends on 1) The heat dissipator according to claim 1, wherein an elastic gasket is disposed between the combination pin fin and the orifice plate, and the combination pin fin is in contact with the orifice plate by using the elastic gasket. ### Claim 4 (depends on 1) The heat dissipator according to claim 1, wherein a feature size of each combination pin fin is less than or equal to 1 mm; and the feature size=4×an area of a cross section/a perimeter of the cross section. ### Claim 5 (depends on 4) The heat dissipator according to claim 4, wherein a ratio of a height to the feature size of each combination pin fin is greater than or equal to 5. ### Claim 6 (depends on 4) The heat dissipator according to claim 4, wherein a ratio of a gap between two adjacent combination pin fins to each of feature sizes of the combination pin fins ranges from 1:0.9 to 1:1.1. ### Claim 7 (depends on 1) The heat dissipator according to claim 1, wherein a diameter of the plurality of through holes on the orifice plate ranges from 0.2 mm to 2.0 mm. ### Claim 8 (depends on 1) The heat dissipator according to claim 1, wherein partition plates facing the cover plate are disposed on a surface of the orifice plate in the distribution cavity, the partition plates partition the distribution cavity into the plurality of inflow cavities and the plurality of outflow cavities, and the plurality of inflow cavities and the plurality of outflow cavities separately communicate with the heat exchange cavity by using the plurality of through holes disposed on the orifice plate; and the plurality of inflow cavities are provided with a fluid inlet, and the plurality of outflow cavities are provided with a fluid outlet. ### Claim 9 (depends on 8) The heat dissipator according to claim 8, wherein the plurality of inflow cavities and the plurality of outflow cavities are alternately distributed. ### Claim 10 (depends on 8) The heat dissipator according to claim 8, wherein a diameter of a through hole, from the plurality of through holes, communicating with the inflow cavity, from the plurality of inflow cavities, is less than a diameter of a through hole, from the plurality of through holes, communicating with the outflow cavity, from the plurality of outflow cavities. ### Claim 11 (depends on 8) The heat dissipator according to claim 8, wherein diameters of the plurality of through holes communicating with the plurality of outflow cavities gradually increase in a direction from approaching the fluid inlet to away from the fluid inlet. ### Claim 12 (depends on 1) The heat dissipator according to claim 1, wherein the distribution cavity is provided with a fluid inlet, and the heat exchange cavity is provided with a fluid outlet. ### Claim 13 (depends on 12) The heat dissipator according to claim 12, wherein diameters of the plurality of through holes gradually decrease in a direction from approaching the fluid inlet to away from the fluid inlet. ### Claim 14 (depends on 1) The heat dissipator of claim 1, wherein the combination pin fin and the first flow guiding pin fin are made from any of aluminum alloy, brass, or red copper. ### Claim 15 (depends on 1) The heat dissipator of claim 1, wherein when heat dissipation is performed on the heat dissipator, a fluid, having a temperature less than a heat emitting apparatus, enters a fluid passage constituted by the combination pin fin and the first flow guiding pin fin, to participate in heat exchanging. ### Claim 16 (depends on 1) The heat dissipator of claim 1, wherein the distribution cavity includes the plurality of inflow cavities and the plurality of outflow cavities, the plurality of inflow cavities and the plurality of outflow cavities are alternatively distributed, and a diameter of a through hole, from the plurality of through holes, communicating with the plurality of inflow cavities can range from 0.2 mm to 0.5 mm, and a diameter of a through hole, from the plurality of through holes, communicating with the plurality of outflow cavities can range from 1.5 mm to 2.0 mm. ### Claim 17 A communications device, comprising: a heat emitting apparatus; and a heat dissipator, wherein the heat dissipator comprises: a cover plate; an orifice plate; and a base plate in contact with the heat emitting apparatus, wherein the cover plate, the orifice plate, and the base plate are configured to be stacked in sequence, a distribution cavity is disposed between the orifice plate and the cover plate, a heat exchange cavity is disposed between the orifice plate and the base plate, the distribution cavity is configured to communicate with the heat exchange cavity by using a plurality of through holes disposed on the orifice plate, and a plurality of pin fins facing the orifice plate are disposed on a surface of the base plate in the heat exchange cavity, gaps between the plurality of pin fins constitute a fluid passage, and the plurality of pin fins comprise: a combination pin fin in contact with the orifice plate, and a first flow guiding pin fin associated with a through hole, from the plurality of through holes, and having a gap with the through hole, wherein the first flow guiding pin fin corresponds to an inflow cavity, from a plurality of inflow cavities, and a second flow guiding pin fin corresponding to an outflow cavity, from a plurality of outflow cavities, wherein a height of the first flow guiding pin fin is greater than a height of the second flow guiding pin fin. ### Claim 18 A heat dissipator, comprising: a cover plate; an orifice plate having a plurality of through holes disposed thereon; a distribution cavity disposed between the orifice plate and the cover plate; a base plate; a heat exchange cavity disposed between the orifice plate and the base plate; and a plurality of pin fins facing the orifice plate and disposed on a surface of the base plate in the heat exchange cavity, wherein the distribution cavity is configured to communicate with the heat exchange cavity by using the plurality through holes disposed on the orifice plate, and the plurality of pin fins comprise: a combination pin fin in contact with the orifice plate, and a first flow guiding pin fin associated with a through hole, from the plurality of through holes, and having a gap with the through hole, wherein the first flow guiding pin fin corresponds to an inflow cavity, from a plurality of inflow cavities, and a second flow guiding pin fin corresponding to an outflow cavity, from a plurality of outflow cavities, wherein a height of the first flow guiding pin fin is greater than a height of the second flow guiding pin fin. ### Claim 19 (depends on 18) The heat dissipator of claim 18, wherein gaps between the plurality of pin fins constitute a fluid passage.