# US 11,310,920 B2 · Circuit board, method for manufacturing the same, and backlight > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,310,920 B2 - Document ID: US11310920B2 - Status: Granted - Kind: B2 - Application number: 16/959,137 - Filed: 2019-05-30 - Published: 2021-12-30 - Granted: 2022-04-19 - Earliest claimed: 2019-05-30 - Assignees: Hong Heng Sheng Electronical Technology (HuaiAn) Co., Ltd; Avary Holding (Shenzhen) Co., Limited. - Applicants: Hong Heng Sheng Electronical Technology (HuaiAn)Co., Ltd.; Avary Holding (Shenzhen) Co., Limited. - Inventors: Zu-Ai Li; Si-Hong He; Mei-Hua Huang; Ning Hou - Web page: https://patentgrep.com/patent/US11310920B2 ## CPC - H05K 3/3452: Solder masks - B23K 1/20: Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating - H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)} - H05K 1/056: {the metal substrate being covered by an organic insulating layer} - H05K 3/06: the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - B23K 2101/36: Electric or electronic devices - H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs - H05K 2201/0358: Resin coated copper [RCC] - H05K 2201/09036: Recesses or grooves in insulating substrate - H05K 2201/09072: Hole or recess under component or special relationship between hole and component - H05K 2201/10106: Light emitting diode [LED] - H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor - H05K 2201/2054: Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics - H10W 90/00: Package configurations - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A circuit board (100) includes an insulating base layer (11), a first conductive circuit layer (40) disposed on the base layer (11); a solder mask layer (60) covering the first conductive circuit layer (40) away from the base layer (11), wherein the solder mask layer (60) defines a slot (601), the slot (601) exposes a portion of the first conductive circuit layer (40), the solder mask layer (60) includes a sidewall (602) at the slot (601); and a cover film (70) covering the solder mask layer (60), wherein the cover film (70) defines an opening (701), the opening (701) corresponds to the slot (601) and exposes the solder pad (7401), the cover film (70) includes a covering portion (74) and a side reflecting portion (75), the covering portion (74) is disposed on the solder mask layer (60), the side reflecting portion (75) is connected to the covering portion (74) and covers the sidewall (602). ## Claims ### Claim 1 A method of manufacturing a circuit board, comprising: providing a circuit substrate, the circuit substrate comprising an insulating base layer and a first conductive circuit layer disposed on a surface of the base layer; disposing a solder mask layer on a surface of the first conductive circuit layer away from the base layer; defining a slot in the solder mask layer, the slot configured to expose a portion of the first conductive circuit layer, the exposed portion of the first conductive circuit layer forming a solder pad, the solder mask layer comprising a sidewall at the slot; disposing a cover film on a surface of the solder mask layer having the slot away from the first conductive circuit layer, the cover film comprising a first light diffusing material; defining an opening in the cover film, the opening corresponding to the slot and being configured to expose the solder pad, the cover film comprising a covering portion and an extending portion, the covering portion being disposed on the solder mask layer having the slot, the extending portion being connected to the covering portion, protruding from the sidewall, and surrounding the opening; and pressing the extending portion to the sidewall to form a side reflecting portion. ### Claim 2 (depends on 1) The method for manufacturing the circuit board of claim 1, wherein the cover film comprises an adhesive layer and an insulating layer, the adhesive layer is disposed on the surface of the solder mask layer away from the first conductive circuit layer, the insulating layer is disposed on a surface of the adhesive layer away from the solder mask layer, the insulating layer is made of resin, and the first light diffusing material is added to the resin of the insulating layer. ### Claim 3 (depends on 1) The method for manufacturing the circuit board of claim 1, wherein the solder mask layer comprises a white solder resist ink. ### Claim 4 (depends on 1) The method for manufacturing the circuit board of claim 1, wherein the base layer is made of resin, and a second light diffusing material is added to the resin of the base layer. ### Claim 5 (depends on 1) The method for manufacturing the circuit board of claim 1, wherein a length of the extending portion protruding from the sidewall is equal to a height of the sidewall, so that the sidewall is entirely covered by the side reflecting portion. ### Claim 6 (depends on 1) The method for manufacturing the circuit board of claim 1, wherein a length of the extending portion protruding from the sidewall is smaller than a height of the sidewall, so that a bottom of the sidewall away from the cover film is exposed from the side reflecting portion. ### Claim 7 (depends on 1) The method for manufacturing the circuit board of claim 1, wherein a length of the extending portion protruding from the sidewall is greater than a height of the sidewall, so that the sidewall and a portion of the base layer near the sidewall are covered by the side reflecting portion. ### Claim 8 (depends on 1) The method for manufacturing the circuit board of claim 1, further comprising: performing a surface treatment on the solder pad. ### Claim 9 (depends on 1) The method for manufacturing the circuit board of claim 1, wherein providing the circuit substrate comprises: providing a copper substrate, the copper substrate comprising the base layer and a copper foil disposed on the surface of the base layer; forming a copper-plated layer on a surface of the copper foil away from the base layer; and etching the copper-plated layer and the copper foil to obtain the first conductive circuit layer, thereby obtaining the circuit substrate. ### Claim 10 A circuit board, comprising: an insulating base layer; a first conductive circuit layer disposed on a surface of the base layer; a solder mask layer covering a surface of the first conductive circuit layer away from the base layer, wherein the solder mask layer defines a slot, the slot is configured to expose a portion of the first conductive circuit layer, the exposed portion of the first conductive circuit layer forms a solder pad, the solder mask layer comprises a sidewall at the slot; and a cover film covering a surface of the solder mask layer away from the first conductive circuit layer, wherein the cover film comprises a first light diffusing material, the cover film defines an opening, the opening corresponds to the slot and is configured to expose the solder pad, the cover film comprises a covering portion and a side reflecting portion, the covering portion is disposed on the solder mask layer having the slot, the side reflecting portion is connected to the covering portion and covers the sidewall. ### Claim 11 (depends on 10) The circuit board of claim 10, wherein the cover film comprises an adhesive layer and an insulating layer, the adhesive layer is disposed on the surface of the solder mask layer away from the first conductive circuit layer, the insulating layer is disposed on a surface of the adhesive layer away from the solder mask layer, the insulating layer is made of resin, and the first light diffusing material is added to the resin of the insulating layer. ### Claim 12 (depends on 10) The circuit board of claim 10, wherein the solder mask layer comprises a white solder resist ink. ### Claim 13 (depends on 10) The circuit board of claim 10, wherein the base layer is made of resin, and a second light diffusing material is added to the resin of the base layer. ### Claim 14 A backlight, comprising: a light emitting element; and a circuit board, comprising: an insulating base layer; a first conductive circuit layer disposed on a surface of the base layer; a solder mask layer covering a surface of the first conductive circuit layer away from the base layer, wherein the solder mask layer defines a slot, the slot is configured to expose a portion of the first conductive circuit layer, the exposed portion of the first conductive circuit layer forms a solder pad, the solder mask layer comprises a sidewall at the slot; and a cover film covering a surface of the solder mask layer away from the first conductive circuit layer, wherein the cover film comprises a first light diffusing material, the cover film defines an opening, the opening corresponds to the slot and is configured to expose the solder pad, the cover film comprises a covering portion and a side reflecting portion, the covering portion is disposed on the solder mask layer having the slot, the side reflecting portion is connected to the covering portion and covers the sidewall, and the light emitting element is electrically connected to the solder pad. ### Claim 15 (depends on 14) The backlight of claim 14, wherein the cover film comprises an adhesive layer and an insulating layer, the adhesive layer is disposed on the surface of the solder mask layer away from the first conductive circuit layer, the insulating layer is disposed on a surface of the adhesive layer away from the solder mask layer, the insulating layer is made of resin, and the first light diffusing material is added to the resin of the insulating layer. ### Claim 16 (depends on 14) The backlight of claim 14, wherein the solder mask layer comprises a white solder resist ink. ### Claim 17 (depends on 14) The backlight of claim 14, wherein the base layer is made of resin, and a second light diffusing material is added to the resin of the base layer.