# US 11,310,918 B2 · Method for producing plated component, plated component, catalytic activity inhibitor and composite material for electroless plating > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,310,918 B2 - Document ID: US11310918B2 - Status: Granted - Kind: B2 - Application number: 17/228,897 - Filed: 2021-04-13 - Published: 2021-07-29 - Granted: 2022-04-19 - Earliest claimed: 2016-03-11 - Assignees: Maxell, Ltd. - Applicants: Maxell, Ltd. - Inventors: Naoki Usuki; Akiko Kito; Atsushi Yusa - Web page: https://patentgrep.com/patent/US11310918B2 ## CPC - H05K 3/182: {characterised by the patterning method} - C08G 83/003: {Dendrimers} - C08L 33/26: Homopolymers or copolymers of acrylamide or methacrylamide - C08L 81/02: Polythioethers; Polythioether-ethers - C23C 18/1608: {from pretreatment step, i.e. selective pre-treatment} - C23C 18/1612: {through irradiation means} - C23C 18/1644: {porous substrates} - C23C 18/204: {Radiation, e.g. UV, laser} - C23C 18/2066: {Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers} - C23C 18/285: {Sensitising or activating with tin based compound or composition} - C23C 18/38: Coating with copper - H05K 3/18: using precipitation techniques to apply the conductive material - H05K 3/4661: {Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor (other insulating materials H05K3/387)} - C08L 2203/20: use in electrical or conductive gadgets - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) ## Abstract A method for producing a plated part, includes: forming, on a surface of a base member, a catalyst activity inhibiting layer containing a polymer which has at least one of an amide group and an amino group; irradiating with light or heating a part of the surface of the base member on which the catalyst activity inhibiting layer is formed; applying an electroless plating catalyst to the surface of the base member heated or irradiated with the light; and bringing an electroless plating solution into contact with the surface of the base member to which the electroless plating catalyst is applied, to form an electroless plating film at a light-irradiated portion or a heated portion of the surface. ## Claims ### Claim 1 A method for producing a plated part, comprising: forming, on a surface of a base member, a catalyst activity inhibiting layer containing a dendritic polymer which has an aromatic ring and at least one of an amide group and an amino group, wherein the dendritic polymer has a group containing sulfur; irradiating with light or heating a part of the surface of the base member on which the catalyst activity inhibiting layer is formed; applying an electroless plating catalyst to the surface of the base member heated or irradiated with the light; and bringing an electroless plating solution into contact with the surface of the base member to which the electroless plating catalyst is applied, to form an electroless plating film at a light-irradiated portion or a heated portion of the surface. ### Claim 2 (depends on 1) The method for producing the plated part according to claim 1, further comprising washing the surface of the base member after the part of the surface of the base member is heated or irradiated with the light and before the electroless plating solution is brought into contact with the surface of the base member. ### Claim 3 (depends on 1) The method for producing the plated part according to claim 1, wherein an inhibiting layer-removed portion from which the catalyst activity inhibiting layer is removed and an inhibiting layer-remaining portion in which the catalyst activity inhibiting layer remains are formed on the base member by the irradiating with the light or the heating the part of the surface of the base member, and the electroless plating film is formed at the inhibiting layer-removed portion. ### Claim 4 (depends on 1) The method for producing the plated part according to claim 1, wherein the dendritic polymer is a hyper-branched polymer. ### Claim 5 (depends on 1) The method for producing the plated part according to claim 1, wherein the dendritic polymer has a number average molecular weight of 3,000 to 30,000 and has a weight average molecular weight of 10,000 to 300,000. ### Claim 6 (depends on 1) The method for producing the plated part according to claim 1, wherein the group containing sulfur is a sulfide group or a dithiocarbamate group. ### Claim 7 A method for producing a plated part, comprising: forming, on a surface of a base member, a catalyst activity inhibiting layer containing a dendritic polymer which has an aromatic ring and at least one of an amide group and an amino group wherein the dendritic polymer is represented by the following formula (1), in the formula (1), A1 is a group containing an aromatic ring, A2 is a group containing sulfur or an amino group, R1 is a single bond or a substituted or unsubstituted alkylene group having 1 to 5 carbon atoms, each of R2 and R3 is hydrogen or a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and m1 is in a range of 1 to 10, and n1 is in a range of 5 to 100; irradiating with light or heating a part of the surface of the base member on which the catalyst activity inhibiting layer is formed; applying an electroless plating catalyst to the surface of the base member heated or irradiated with the light; and bringing an electroless plating solution into contact with the surface of the base member to which the electroless plating catalyst is applied, to form an electroless plating film at a light-irradiated portion or a heated portion of the surface. ### Claim 8 (depends on 7) The method for producing the plated part according to claim 7, wherein the dendritic polymer is represented by the formula (1), and wherein in the formula (1), A1 is a group represented by the following formula (2): A2 is a dithiocarbamate group, R1 is a single bond, R2 is hydrogen, and R3 is an isopropyl group. ### Claim 9 (depends on 7) The method for producing the plated part according to claim 7, further comprising washing the surface of the base member after the part of the surface of the base member is heated or irradiated with the light and before the electroless plating solution is brought into contact with the surface of the base member. ### Claim 10 (depends on 7) The method for producing the plated part according to claim 7, wherein an inhibiting layer-removed portion from which the catalyst activity inhibiting layer is removed and an inhibiting layer-remaining portion in which the catalyst activity inhibiting layer remains are formed on the base member by the irradiating with the light or the heating the part of the surface of the base member, and the electroless plating film is formed at the inhibiting layer-removed portion. ### Claim 11 (depends on 7) The method for producing the plated part according to claim 7, wherein the dendritic polymer is a hyper-branched polymer. ### Claim 12 (depends on 7) The method for producing the plated part according to claim 7, wherein the dendritic polymer has a number average molecular weight of 3,000 to 30,000 and has a weight average molecular weight of 10,000 to 300,000.